MAX2062 Dual 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Analog/Digital VGA General Description Features The MAX2062 high-linearity, dual analog/digital variable- S Independently Controlled Dual Paths gain amplifier (VGA) operates in the 50MHz to 1000MHz S 50MHz to 1000MHz RF Frequency Range frequency range with two independent attenuators in S Pin-Compatible Family Includes each signal path. Each digital attenuator is controlled MAX2063 (Digital-Only VGA) as a slave peripheral using either the SPI-compatible MAX2064 (Analog-Only VGA) interface, or a 5-bit parallel bus with 31dB total adjust- S 19.4dB (typ) Maximum Gain ment range in 1dB steps. An added feature allows rapid-fire gain selection among each of the four steps, S 0.34dB Gain Flatness Over 100MHz Bandwidth preprogrammed by the user through the SPI-compatible S 64dB Gain Range (33dB Analog Plus 31dB Digital) interface. A separate 2-pin control lets the user quickly S 56dB Path Isolation (at 200MHz) access any one of four customized attenuation states without reprogramming the SPI bus. Each analog attenu- S Built-In 8-Bit DACs for Analog Attenuation Control ator is controlled using an external voltage or through the S Supports Four Rapid-Fire Preprogrammed SPI-compatible interface using an on-chip 8-bit DAC. Attenuator States Since each of the stages has its own external RF input Quickly Access Any One of Four Customized and RF output, this component can be configured to Attenuator States either optimize noise figure (NF) (amplifier configured Ideal for Fast-Attack, High-Level Blocker first), OIP3 (amplifier last), or a compromise of NF and Protection OIP3. The devices performance features include 24dB Protects ADC Overdrive Condition amplifier gain (amplifier only), 7.3dB NF at maximum S Excellent Linearity (Configured with Amp Last at gain (includes attenuator insertion losses), and a high 200MHz) OIP3 level of +41dBm. Each of these features makes +41dBm OIP3 the device an ideal VGA for multipath receiver and trans- +56dBm OIP2 mitter applications. +19dBm Output 1dB Compression Point In addition, the device operates from a single +5V S 7.3dB Typical Noise Figure (at 200MHz) supply with full performance or a +3.3V supply for an S Fast, 25ns Digital Switching enhanced power-savings mode with lower performance. The device is available in a compact 48-pin TQFN S Very Low Digital VGA Amplitude Overshoot/ package (7mm x 7mm) with an exposed pad. Electrical Undershoot performance is guaranteed over the extended tempera- S Single +5V Supply (or +3.3V Operation) ture range, from T = -40NC to +85NC. C S Amplifier Power-Down Mode for TDD Applications Applications Ordering Information IF and RF Gain Stages Temperature-Compensation Circuits PART TEMP RANGE PIN-PACKAGE MAX2062ETM+ -40NC to +85NC 48 TQFN-EP* GSM/EDGE Base Stations MAX2062ETM+T -40NC to +85NC 48 TQFN-EP* M WCDMA, TD-SCDMA, and cdma2000 Base Stations +Denotes lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. M WiMAX , LTE, and TD-LTE Base Stations and T = Tape and reel. Customer-Premise Equipment Fixed Broadband Wireless Access Wireless Local Loop cdma2000 is a registered certification mark and registered service mark of the Telecommunications Industry Association. WiMAX is a registered certification mark and registered ser- vice mark of the WiMAX Forum. For pricing, delivery, and ordering information, please contact Maxim Direct 19-5511 Rev 2 8/15 at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com.MAX2062 Dual 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Analog/Digital VGA ABSOLUTE MAXIMUM RATINGS V , V , V to GND ..........-0.3V to +5.5V REG OUT to GND ................................................-0.3V to +3.6V CC AMP 1 CC AMP 2 CC RG STA A 1, STA A 2, STA B 1, STA B 2, RF Input Power (D ATT IN 1, D ATT IN 2) ............... +20dBm PD 1, PD 2, AMPSET to GND .........................-0.3V to +3.6V RF Input Power (A ATT IN 1, A ATT IN 2) .............. +20dBm A VCTL 1, A VCTL 2 to GND .............................-0.3V to +3.6V RF Input Power (AMP IN 1, AMP IN 2) ...................... +18dBm DAT, CS, CLK, AA SP, DA SP to GND ...............-0.3V to +3.6V q (Notes 1, 2) ......................................................... +12.3NC/W JC D0 1, D1 1, D2 1, D3 1, D4 1, D0 2, D1 2, q (Notes 2, 3) ............................................................ +38NC/W JA D2 2, D3 2, D4 2 to GND ...............................-0.3V to +3.6V Continuous Power Dissipation (Note 1) ..............................5.3W AMP IN 1, AMP IN 2 to GND ..........................+0.95V to +1.2V Operating Case Temperature Range (Note 4) .. -40NC to +85NC AMP OUT 1, AMP OUT 2 to GND .....................-0.3V to +5.5V Junction Temperature .....................................................+150NC D ATT IN 1, D ATT IN 2, D ATT OUT 1, Storage Temperature Range ............................ -65NC to +150NC D ATT OUT 2 to GND .........................................0V to +3.6V Lead Temperature (soldering, 10s) ................................+300NC A ATT IN 1, A ATT IN 2, A ATT OUT 1, Soldering Temperature (reflow) ......................................+260NC A ATT OUT 2 to GND .........................................0V to +3.6V Note 1: Based on junction temperature T = T + (q x V x I ). This formula can be used when the temperature of the exposed J C JC CC CC pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150NC. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Note 3: Junction temperature T = T + (q x V x I ). This formula can be used when the ambient temperature of the PCB is J A JA CC CC known. The junction temperature must not exceed +150NC. Note 4: T is the temperature on the exposed pad of the package. T is the ambient temperature of the device and PCB. C A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, V = V = V = V = 4.75V to 5.25V, AMPSET = 0, PD 1 = PD 2 = 0, CC CC AMP 1 CC AMP 2 CC RG T = -40NC to +85NC. Typical values are at V = 5.0V and T = +25NC, unless otherwise noted.) C CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.75 5 5.25 V CC Supply Current I 148 210 mA DC Power-Down Current I PD 1 = PD 2 = 1, V = 3.3V 5.3 8 mA DCPD IH Logic-Low Input Voltage V 0.5 V IL Logic-High Input Voltage V 1.7 3.465 V IH Input Logic Current I I -1 +1 FA IH, IL 3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, V = V = V = V = 3.135V to 3.465V, AMPSET = 1, PD 1 = PD 2 = 0, CC CC AMP 1 CC AMP 2 CC RG T = -40NC to +85NC. Typical values are at V = 3.3V and T = +25NC, unless otherwise noted.) C CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 3.135 3.3 3.465 V CC Supply Current I 87 145 mA DC Power-Down Current I PD 1 = PD 2 = 1, V = 3.3V 4.5 8 mA DCPD IH Logic-Low Input Voltage V 0.5 V IL Logic-High Input Voltage V 1.7 V IH 2 Maxim Integrated