MAX2063 Dual 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA General Description Features The MAX2063 high-linearity, dual digital variable-gain S Independently Controlled Dual Paths amplifier (VGA) operates in the 50MHz to 1000MHz S 50MHz to 1000MHz RF Frequency Range frequency range. Each digital attenuator is controlled S Pin-Compatible Family Includes as a slave peripheral using either the SPI-compatible MAX2062 (Analog/Digital VGA) interface or a 5-bit parallel bus with 31dB total adjust- MAX2064 (Analog-Only VGA) ment range in 1dB steps. An added feature allows S 21.3dB (typ) Maximum Gain rapid-fire gain selection between each of four steps, preprogrammed by the user through the SPI-compatible S 0.25dB Gain Flatness Over 100MHz Bandwidth interface. A separate 2-pin control allows the user to S 31dB Gain Range quickly access any one of four customized attenuation S 58dB Path Isolation at 200MHz states without reprogramming the SPI bus. S Supports Four Rapid-Fire Preprogrammed Since each of the stages has its own external RF input Attenuator States and RF output, this component can be configured Quickly Access Any One of Four Customized to either optimize noise figure (amplifier configured Attenuation States Without Reprogramming the first) or OIP3 (amplifier configured last). The devices SPI Bus performance features include 24dB of amplifier gain Ideal for Fast-Attack, High-Level Blocker (amplifier only), 5.6dB noise figure (NF) at maximum Protection gain (including attenuator insertion losses), and a high Prevents ADC Overdrive Condition OIP3 level of +41dBm. Each of these features makes the device an ideal VGA for multipath receiver and transmitter S Excellent Linearity at 200MHz applications. +41dBm OIP3 +56dBm OIP2 In addition, the device operates from a single +5V +19dBm Output 1dB Compression Point supply with full performance, or a +3.3V supply for an S 5.6dB Typical Noise Figure enhanced power-savings mode with lower performance. This device is available in a compact 48-pin thin QFN S 25ns Digital Switching Time package (7mm x 7mm) with an exposed pad. Electrical S Very Low Distortion VGA Amplitude Overshoot/ performance is guaranteed over the extended tempera- Undershoot of 0.05dB ture range, from T = -40NC to +85NC. C S Single +5V Supply (or +3.3V Operation) Applications S Amplifier Power-Down Mode for TDD Applications IF and RF Gain Stages Temperature-Compensation Circuits Ordering Information M Cellular Band WCDMA and cdma2000 Base PART TEMP RANGE PIN-PACKAGE Stations MAX2063ETM+ -40NC to +85NC 48 Thin QFN-EP* GSM 850/GSM 900 EDGE Base Stations MAX2063ETM+T -40NC to +85NC 48 Thin QFN-EP* M WiMAX and LTE Base Stations and Customer +Denotes a lead(Pb)-free/RoHS-compliant package. Premise Equipment *EP = Exposed pad. Fixed Broadband Wireless Access T = Tape and reel. Wireless Local Loop cdma2000 is a registered certification mark and registered service mark of the Telecommunications Industry Association. WiMAX is a registered certification mark and registered ser- vice mark of the WiMAX Forum. For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com. 19-5303 Rev 1 8/15MAX2063 Dual 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA ABSOLUTE MAXIMUM RATINGS V , V , V to GND ..........-0.3V to +5.5V RF Input Power (D ATT IN 1, D ATT IN 2) ............... +20dBm CC AMP 1 CC AMP 2 CC RG STA A 1, STA A 2, STA B 1, STA B 2, PD 1, RF Input Power (AMP IN 1, AMP IN 2) ...................... +18dBm PD 2, AMPSET to GND ...................................-0.3V to +3.6V q (Notes 1, 2) ......................................................... +12.3NC/W JC DAT, CS, CLK, DA SP to GND ............................-0.3V to +3.6V q (Notes 2, 3) ............................................................ +38NC/W JA D0 1, D1 1, D2 1, D3 1, D4 1, D0 2, D1 2, Continuous Power Dissipation (Note 1) ..............................5.3W D2 2, D3 2, D4 2 to GND ...............................-0.3V to +3.6V Operating Case Temperature Range (Note 4) .. -40NC to +85NC AMP IN 1, AMP IN 2 to GND ..........................+0.95V to +1.2V Junction Temperature .....................................................+150NC AMP OUT 1, AMP OUT 2 to GND .....................-0.3V to +5.5V Storage Temperature Range ............................ -65NC to +150NC D ATT IN 1, D ATT IN 2, D ATT OUT 1, Lead Temperature (soldering, 10s) ................................+300NC D ATT OUT 2 to GND .........................................0V to +3.6V Soldering Temperature (reflow) ......................................+260NC REG OUT to GND ................................................-0.3V to +3.6V Note 1: Based on junction temperature T = T + (B x V x I ). This formula can be used when the temperature of the exposed J C JC CC CC pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150NC. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Note 3: Junction temperature T = T + (B x V x I ). This formula can be used when the ambient temperature of the PCB is J A JA CC CC known. The junction temperature must not exceed +150NC. Note 4: T is the temperature on the exposed pad of the package. T is the ambient temperature of the device and PCB. C A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. +5V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, V = V = V = V = +4.75V to +5.25V, AMPSET = 0, PD 1 = PD 2 = 0, T = CC CC AMP 1 CC AMP 2 CC RG C -40NC to +85NC. Typical values are at V = +5.0V and T = +25NC, unless otherwise noted.) CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.75 5 5.25 V CC Supply Current I 148 205 mA DC Power-Down Current I PD 1 = PD 2 = 1, V = 3.3V 5.2 8 mA DCPD IH Input Low Voltage V 0.5 V IL Input High Voltage V 1.7 3.465 V IH Input Logic Current I , I -1 +1 FA IH IL +3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, V = V = V = V = +3.135V to +3.465V, AMPSET = 1, PD 1 = PD 2 = 0, T CC CC AMP 1 CC AMP 2 CC RG C = -40NC to +85NC. Typical values are at V = +3.3V and T = +25NC, unless otherwise noted.) CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 3.135 3.3 3.465 V CC Supply Current I 88 145 mA DC Power-Down Current I PD 1 = PD 2 = 1, V = 3.3V 4.3 8 mA DCPD IH Input Low Voltage V 0.5 V IL Input High Voltage V 1.7 3.465 V IH 2 Maxim Integrated