MAX2064 Dual 50MHz to 1000MHz High-Linearity, Serial/Analog-Controlled VGA General Description Features The MAX2064 high-linearity, dual analog variable-gain S Independently Controlled Dual Paths amplifier (VGA) operates in the 50MHz to 1000MHz S 50MHz to 1000MHz RF Frequency Range frequency range. Each analog attenuator is controlled S Pin-Compatible Family Includes using an external voltage, or through the SPI-compatible MAX2062 (Analog/Digital VGA) interface using an on-chip 8-bit DAC. MAX2063 (Digital-Only VGA) Since each of the stages has its own external RF S 22dB (typ) Maximum Gain input and RF output, this component can be con- figured to either optimize noise figure (NF) (ampli- S 0.19dB Gain Flatness Over 100MHz Bandwidth fier configured first) or OIP3 (amplifier last). The S 33dB Gain Range devices performance features include 24dB ampli- fier gain (amplifier only), 4.4dB NF at maximum gain S 49dB Path Isolation (at 200MHz) (includes attenuator insertion losses), and a high S Built-In 8-Bit DACs for Analog Attenuation Control OIP3 level of +41dBm. Each of these features makes S Excellent Linearity at 200MHz (Configured with the device an ideal VGA for multipath receiver and Amp Last) transmitter applications. +41dBm OIP3 In addition, the device operates from a single +5V +59dBm OIP2 supply with full performance, or a +3.3V supply for an +19dBm Output 1dB Compression Point enhanced power-savings mode with lower performance. S 4.4dB Typical Noise Figure (at 200MHz) The device is available in a compact 48-pin TQFN package (7mm x 7mm) with an exposed pad. Electrical S Single +5V Supply (or +3.3V Operation) performance is guaranteed over the extended tempera- S Amplifier Power-Down Mode for TDD Applications ture range, from T = -40NC to +85NC. C Ordering Information Applications PART TEMP RANGE PIN-PACKAGE IF and RF Gain Stages MAX2064ETM+ -40NC to +85NC 48 TQFN-EP* Temperature-Compensation Circuits MAX2064ETM+T -40NC to +85NC 48 TQFN-EP* M WCDMA, TD-SCDMA, and cdma2000 Base +Denotes a lead(Pb)-free/RoHS-compliant package. Stations *EP = Exposed pad. T = Tape and reel. GSM 850/GSM 900 EDGE Base Stations M WiMAX , LTE, and TD-LTE Base Stations and Customer-Premise Equipment Fixed Broadband Wireless Access Wireless Local Loop cdma2000 is a registered certification mark and registered service mark of the Telecommunications Industry Association. WiMAX is a registered certification mark and registered ser- vice mark of the WiMAX Forum. For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com. 19-5618 Rev 1 8/15MAX2064 ual 50MHz to 1000MHz High-Linearity, Serial/Analog-Controlled VGA ABSOLUTE MAXIMUM RATINGS V , V , V to GND ..........-0.3V to +5.5V RF Input Power (AMP IN 1, AMP IN 2) .......................+18dBm CC AMP 1 CC AMP 2 CC RG PD 1, PD 2, AMPSET to GND .............................-0.3V to +3.6V q (Notes 1, 2) ......................................................... +12.3NC/W JC A VCTL 1, A VCTL 2 to GND .............................-0.3V to +3.6V q (Notes 2, 3) ............................................................ +38NC/W JA DAT, CS, CLK, AA SP to GND ............................-0.3V to +3.6V Continuous Power Dissipation (Note 1) ..............................5.3W AMP IN 1, AMP IN 2 to GND ..........................+0.95V to +1.2V Operating Case Temperature Range (Note 4) .. -40NC to +85NC AMP OUT 1, AMP OUT 2 to GND .....................-0.3V to +5.5V Junction Temperature .....................................................+150NC A ATT IN 1, A ATT IN 2, A ATT OUT 1, Storage Temperature Range ............................ -65NC to +150NC A ATT OUT 2 to GND .........................................0V to +3.6V Lead Temperature (soldering, 10s) ................................+300NC REG OUT to GND ................................................-0.3V to +3.6V Soldering Temperature (reflow) ......................................+260NC RF Input Power (A ATT IN 1, A ATT IN 2) .................+20dBm Note 1: Based on junction temperature T = T + (q x V x I ). This formula can be used when the temperature of the exposed J C JC CC CC pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150NC. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Note 3: Junction temperature T = T + (q x V x I ). This formula can be used when the ambient temperature of the PCB is J A JA CC CC known. The junction temperature must not exceed +150NC. Note 4: T is the temperature on the exposed pad of the package. T is the ambient temperature of the device and PCB. C A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. +5V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, V = V = V = V = +4.75V to +5.25V, AMPSET = 0, PD 1 = PD 2 = 0, CC CC AMP 1 CC AMP 2 CC RG T = -40NC to +85NC. Typical values are at V = +5.0V and T = +25NC, unless otherwise noted.) C CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.75 5 5.25 V CC Supply Current I 143 210 mA DC Power-Down Current I PD 1 = PD 2 = 1, V = 3.3V 5.3 8 mA DCPD IH Input Low Voltage V 0.5 V IL Input High Voltage V 1.7 3.465 V IH Input Logic Current I I -1 +1 FA IH, IL +3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, V = V = V = V = +3.135V to +3.465V, AMPSET = 1, PD 1 = PD 2 = 0, CC CC AMP 1 CC AMP 2 CC RG T = -40NC to +85NC. Typical values are at V = +3.3V and T = +25NC, unless otherwise noted.) C CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 3.135 3.3 3.465 V CC Supply Current I 84.7 145 mA DC Power-Down Current I PD 1 = PD 2 = 1, V = 3.3V 4.5 8 mA DCPD IH Input Low Voltage V 0.5 V IL Input High Voltage V 1.7 V IH 2 Maxim Integrated