EVALUATION KIT AVAILABLE Click here to ask about the production status of specific part numbers. MAX22506E 50Mbps Half-Duplex RS-485/RS-422 Transceiver with High EFT Immunity General Description Benefits and Features The MAX22506E ESD-protected RS-485/RS-422 trans- High-Speed Operation over Long Distances ceiver is optimized for high-speed communication up to Up to 50Mbps Data Rate 50Mbps. This transceiver features integrated hot-swap High Receiver Sensitivity protection and a fail-safe receiver, ensuring a logic-high Wide Receiver Bandwidth on the receiver output when input signals are shorted or Symmetrical Receiver Thresholds open for longer than 10s (typ). Additionally, a large re- Integrated Protection Increases Robustness ceiver hysteresis improves noise rejection and signal in- -15V to +15V Common-Mode Range tegrity. 15kV ESD Protection (Human Body Model) The MAX22506E is designed to operate in harsh industrial 7kV IEC 61000-4-2 Air-Gap ESD Protection environments and is optimized for robust communication 6kV IEC 61000-4-2 Contact Discharge ESD in environments with high levels of electromagnetic inter- Protection ference (EMI). Withstands Over 4kV EFT Driver Outputs are Short-Circuit Protected The MAX22506E is available in an 8-pin SOIC and an 8-pin MAX package. The transceiver operates over the Flexibility for Many Different Applications -40C to +125C temperature range. 3V to 5.5V Supply Range Low 5A (max) Shutdown Current Available in 8-pin SOIC and MAX Packages Applications -40C to +125C Operating Temperature Range Motion Control Encoder Interfaces Ordering Information appears at end of data sheet. Field Bus Networks Industrial Control Systems Simplified Block Diagram Backplane Busses V CC RO R RE B SHUTDOWN DE A DI D MAX22506EMAX22506E GND MAX is a registered trademark of Maxim Integrated Products, Inc. 19-100995 Rev 1 5/21MAX22506E 50Mbps Half-Duplex RS-485/RS-422 Transceiver with High EFT Immunity Absolute Maximum Ratings V ........................................................................... -0.3V to +6V 8-Pin SOIC (derate 7.4mW/C above +70C) ............588.2mW CC RE, DE, DI ................................................................ -0.3V to +6V Operating Temperature Range ..........................-40C to +125C RO .............................................................. -0.3V to (V + 0.3V) Junction Temperature ......................................................+150C CC A, B .......................................................................... -15V to +15V Storage Temperature Range .............................-65C to +150C Short-Circuit Duration (RO, A, B) to GND .................. Continuous Lead Temperature (soldering 10s) ...................................+300C Continuous Power Dissipation (T = +70C) Reflow Temperature ........................................................ +270C A 8-Pin MAX (derate 4.8mW/C above +70C) ........... 387.8mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information MAX8 Package Code U8+1 Outline Number 21-0036 Land Pattern Number 90-0092 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 206.3C/W JA Junction to Case ( ) 42C/W JC SOIC8 Package Code S8+2C Outline Number 21-0041 Land Pattern Number 90-0096 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 136C/W JA Junction to Case ( ) 38C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/ thermal-tutorial. www.maximintegrated.com Maxim Integrated 2