EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX40025C/MAX40026 280ps High-Speed Comparator, Ultra-Low Dispersion with LVDS Outputs General Description Benefits and Features The MAX40025 and MAX40026 are single-supply, high- Fast Propagation Delay: 280ps, Typ speed comparators with a typical propagation delay of Low Overdrive Dispersion: 25ps (V = 10mV to 1V) OD 280ps. The overdrive dispersion is extremely low (typical Supply Voltage 2.7V to 3.6V 25ps), making these comparators ideal for time-of-flight 39.4mW at 2.7V Supply distance measurement applications. Power-Efficient LVDS Outputs -40C to +125C Temperature Range The input common mode range of 1.5V to V + 0.1V DD Automotive AEC-Q100 Qualified (TDFN-8 Version) is compatible with the output swings of several widely Ordering Information appears at end of data sheet. used high-speed trans-impedance amplifiers, such as the MAX40658. Functional Diagram The output stage is LVDS (Low-Voltage Differential Sig- V naling), which helps to minimize power dissipation and in- CC terfaces directly with many FPGAs and CPUs. Comple- mentary outputs help in suppression of common-mode IN+ OUT+ + noise on each output line. MAX40025 LVDS MAX40026 IN- The MAX40025 is offered in a space-saving, tiny, OUT- - 1.218mm x 0.818mm, 6-bump wafer-level package GND (WLP), while the MAX40026 is available in a 2mm x 2mm 8-pin TDFN side-wettable package and meets AEC-Q100 automotive qualification requirements. The MAX40025/ MAX40026 operate over -40C to +125C temperature range and run from a single supply voltage of 2.7V to 3.6V. Applications Distance Sensing in LIDAR, RADAR, and SONAR Time-of-Flight Sensors High-Speed Differential Line Receivers High-Speed Triggering in Oscilloscopes Communications Oscillators Threshold Detectors High-Speed Level-Shifting Test and Measurement Automotive Applications 19-100439 Rev 2 2/19MAX40025C/MAX40026 280ps High-Speed Comparator, Ultra-Low Dispersion with LVDS Outputs Absolute Maximum Ratings V to GND........................................................... -0.3V to +3.6V Continuous Power Dissipation (Multilayer Board) (TDFN) (T = CC A Either IN+ or IN- to GND .............................. -0.3V to V + 0.3V +70C, derate 9.8mW/C above +70C.) ..........................784mW CC Either OUT+ or OUT- to GND ...................... -0.3V to V + 0.3V Operating Temperature Range...........................-40C to +125C DD OUT+ to OUT- ....................................................... -0.5V to +0.5V Junction Temperature.......................................................+150C Current Into Any Pin (Continuous) ...................................... 10mA Storage Temperature Range ..............................-40C to +150C Continuous Power Dissipation (Multilayer Board) (WLP) (T = Soldering Temperature (reflow) ........................................+260C A +70C, derate 10.51mW/C above +70C)....................... 816mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information WLP Package Code W60D1+1 Outline Number 21-100296 Land Pattern Number Refer to Application Note 1891 Thermal Resistance, Four-Layer Board: Junction-to-Ambient ( ) 95.15C/W JA Junction-to-Case Thermal Resistance ( ) N/A JC TDFN-8 Package Code T822Y+3 Outline Number 21-100185 Land Pattern Number 90-100070 Thermal Resistance, Single-Layer Board: Junction-to-Ambient ( ) 130C/W JA Junction-to-Case Thermal Resistance ( ) 8C/W JC Thermal Resistance, Four-Layer Board: Junction-to-Ambient ( ) 102C/W JA Junction-to-Case Thermal Resistance ( ) 8C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/ thermal-tutorial. www.maximintegrated.com Maxim Integrated 2