About Heat Sinks

Technexion Heat Sinks

Heat sinks are an electronic component that is used to manage heat generated by other electronic components, usually processors, keeping them within safe temperature limits. Heat sinks typically come in two forms: active and passive. Active heat sinks are typically comprised of a cooling fan attached to an aluminum alloy metal body. The metal body absorbs and removes heat from the processor, and the fan dissipates the heat away from the processor. Passive heat sinks are made from metal, and their design maximizes the surface area for heat dissipation. The metal body of a passive heat sink also absorbs and removes heat from the processor, however, the heat is dissipated into the surrounding environment. Heat sinks are used to increase the performance and lifetime of electronic components.
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Global Stock ⓘ (▲▼)Price(USD

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Enter Qty ProductMounting StyleHeatsink MaterialFin StyleThermal ResistanceLengthWidthHeightDesigned for
  
             
EDMHSCP12200501


Heat Sinks EDM COMPACT 12mm PASS HEATSINK
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

TechNexion Availability : 1
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USD 15.0822

Multiples of: 1

Heat SinksScrew   12 mm12 mm Lidded Freescale Cpus
WB-HS


Heat Sinks WANDBOARD HEATSINK
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

Technexion Availability : 1
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USD 11.8818

Multiples of: 1

Heat Sink Kits    82 mm52 mm7 mm 
PICOHEATSINKKIT


Heat Sinks PICO HEATSINK + THERMAL PAD + SCREWS + SPACERS + NUTS
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

Technexion Availability : 0
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USD 8.775

Multiples of: 1

         
PICOHS06M2T2020150KIT


Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

Technexion Availability : 0
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USD 9.1408

Multiples of: 1

Heat Sink Kits    41 mm37 mm6 mmNXP i.MX6 UL/ULL
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