5419 (1X36YDS) 3M

Technical Data September, 2010 3M Low Static Polyimide Film Tape 5419 Product Description 3M Low Static Polyimide Film Tape 5419 is a translucent, polyimide film-backed silicone adhesive tape with unique and extremely low electrostatic discharge properties. Product Construction Backing Adhesive Color Standard Roll Length Polyimide Silicone Gold 36 yds. (33 m) Typical Physical Properties Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. ASTM Test Method Adhesion to Steel: 20 oz./in. width (22 N/100 mm) D-3330 Tensile Strength at Break: 33 lbs./in. width (578 N/100 mm) D-3759 Elongation at Break: 60% D-3759 Backing Thickness: 1.0 mil (0.03 mm) D-3652 Total Tape Thickness: 2.7 mil (0.07 mm) D-3652 Temperature Use Range: -100 to 500F (-73 to 260C) Dielectric Strength: 7000 volts D-149 6 Insulation Resistance: >1 10 ohms * Static Charge: (measured at Removal from roll: <150 volts 50% RH, 70F (21C) in an Removal from PWB: <50 volts ESD controlled environment) Outgassing: %TLM = 0.58 %CVCM = 0.24 E-595 Flame Retardancy: Pass per UL-510 product category: OANZ2 File E230409 3 3M Low Static Polyimide Film Tape 5419 Features Employs a proprietary technology that results in extremely low electrostatic discharge at unwind and removal from the PWB. Conventional polyimide tapes can typically generate over 10,000 volts during use which can damage board mounted electronic components. 3M Low Static Polyimide Film Tape 5419 overcomes this problem without any of the typical drawbacks of conventional anti-static or static-free tapes (e.g., variable adhesion and opaqueness). At room temperature the properties of polyimide and polyester film are similar. However, as the temperature increases or decreases, the properties of the polyimide film are less affected than polyester. Polyimide film does not soften at elevated temperatures, thus, the film provides an excellent release surface at elevated temperatures. Gold tab protection during wave solder of printed circuit boards. RoHS compliant. Application Ideas Mask for printed circuit boards during wave solder or solder dip process. Used as release surface in fabrication of parts cured at elevated temperatures. Storage Store under normal conditions of 60 to 80F (16 to 27C) and 40 to 50% R.H. in the original carton. Shelf Life To obtain best performance, use this product within 3 years from date of manufacture. (2)