5516-1.0 3M

Technical Data February 2018 3M Thermally Conductive Silicone Interface Pad 5516 Series Product Description 3M Thermally Conductive Silicone Interface Pad 5516 Series is designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. 3M pad 5516 series consists of a highly conformable and slightly tacky silicone elastomeric sheets filled with thermally conductive ceramic particles that provide enhanced thermal conductivity and excellent electrical insulation performance. Key Features Good softness and conformability even to non-flat surfaces Very good thermal conductivity Good electrical insulation properties Compression relaxation properties reduces pressure to electric components Slight tack allows pre-assembly Good wettability for improved and lower thermal resistance Product Construction/Material Description Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. 3M Thermally Conductive Silicone Interface Pad 5516 Series Property Value Color Gray Base resin Silicone Thickness 0.5 2.0mm* Primary filler type Ceramic 3M pads 5516, 5516S: PET liner Product liner 3M pad 5516BL: Base liner embo-patterned blue film for both faces * Standard thickness range. Custom thickness options available up to 10mm. Contact your local 3M Technical Representative for more information. 3M Thermally Conductive Silicone Interface Pad 5516 Series PET liner 3M pad 5516 5516 Thermally conductive layer PET liner Permanent PEN film for carrier (0.006mm) 5516S Thermally conductive layer 3M pad 5516S PET liner Blue pattern liner 3M pad 5516BL 5516BL Thermally conductive layer Blue pattern liner 3M Thermally Conductive Silicone Interface Pad 5516 Series Applications Integrated chip (IC) packaging heat conduction Heat sink interface COF chip heat conduction LED board thermal interface material (TIM) HD TV IC Chip General gap filling in electronic devices Application Techniques Note: Be sure to read and follow the manufacturers precautions and directions when using solvents. Substrate surfaces should be clean and dry prior to the thermal pad application to ensure best thermal performance. A clean surface can improve the thermal performance of an application. Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface contamination such as dust or fingerprints. Do not use denatured alcohol or glass cleaners, which often contain oily components. Allow the surface to dry for several minutes before applying the thermal pad. More aggressive solvents (such as acetone, methyl ethyl ketone (MEK) or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above. Apply the thermal pad to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the thermal pad during its application. Remove the release liner before application. Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the thermal pads. Rigid substrates are more difficult to assemble without air entrapment as most rigid parts are not flat. Flexible substrates can be assembled to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrate can conform to the other substrates during application. Typical Physical Properties and Performance Characteristics Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Final product specifications and testing methods will be outlined in the products Certificate of Analysis (COA) that is provided once the product is approved by 3M for general commercialization and development work is completed. 3M Thermally Conductive Silicone Interface Pads 5516 Series 1 Property Method Value Thermal Conductivity (W/m-K) ASTM D5470 3.1 W/m-K 3 Density (g/cm , 25C) ASTM D6111 2.9 Operating Long Term (Weeks-Months) 3M test method -50C to 130C Temperature Range Short Term (Hours-Days) -50C to 180C Hardness Shore 00 0.5, 1.0mm Modified ASTM D2240 55 ~ 65 1.5mm ~ 50 ~ 60 Dielectric Breakdown Modified ASTM D149 3.2KV/mm (3M test method) (5516S = 5.2 est.) 14 Volume Resistivity ASTM D257 6.9 x 10 Ohms 1 Methods listed as ASTM are tested in accordance with the ASTM method noted