Technical Data December 2013 3M Thermally Conductive Silicone Interface Pads 5519 and 5519S Product Description 3M Thermally Conductive Silicone Interface Pads 5519 and 5519S are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. These products consist of a highly conformable slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles which provide special features listed as follows. Very high thermal conductivity and good electrical insulation properties. Good softness and conformability even to non-flat surfaces. S version incorporates a thin polymeric film carrier for improved handling. Slight tack allows pre-assembly. Good wettability for better thermal conductivity. 1 Construction 3M Thermally Conductive Silicone Interface Pad 5519 Removable film liner Thermally conductive silicone elastomer Removable film liner Standard thickness (excludes liner): 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm 2 3M Thermally Conductive Silicone Interface Pad 5519S Permanent polymeric film (0.006 mm) carrier Thermally conductive silicone elastomer Removable film liner Standard thickness (excludes liner): 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm 1 Thicknesses greater than 2mm are available. Please consult your local 3M representative for additional details. 2 The 5519S product is also available in a dual permanent polymeric film carrier design. Contact 3M for MOQ information and availability. 3M Thermally Conductive Silicone Interface Pads 5519 and 5519S Typical Physical Properties Note: T he following technical information and data should be considered representative or typical only and should not be used for specification purposes. 3M Thermally Conductive Silicone Interface Pads 5519 and 5519S Property Method Value Note 2 Thermal Conductivity (W/mK) ASTM D5470 4.9 Flammability UL 94 V0 3 Density (g/cm , 25C) 3.1 Note 1 Hardness Shore 00 5519 70 5519S 75 14 Volume Resistivity (-cm) ASTM D257 1.7 x 10 Dielectric Strength (kV/mm) ASTM D149 1.5 (5519S = 3.5 est.) Dielectric Constant ASTM D150 19.5 (1-100 kHz) Notes: 1) Shore OO Test Method based on a 6mm thick sample. Results will vary for different thickness samples. 2) Thermal conductivity can vary with test method and/or equipment used for testing at different test sites. Thermal K based on testing of the 5519. Effective Thermal K and Thermal Resistance will be somewhat reduced with the addition of the polymeric film of the 5519S constructions. Compression vs. Stress 100% 3M Thermally Conductive Silicone Interface Pad 5519 (1 mm) Rate: 0.5 mm/min 80% 60% 40% 20% 0% 0 1 2 3 4 5 Stress (MPa) Note: C ompression vs Stress test results can vary between test methods based on sample size, exact test set-up, equipment type, etc. Environmental Aging Data Heat resistance of 1.0 mm 3M Thermally Conductive Silicone Interface Pad 5519 Duration (hrs) Initial 500 1000 3000 Thermal Conductivity (W/mK) 4.9 4.9 4.9 4.9 Hardness (Shore 00) 69 70 70 70 Appearance No effect No effect No effect Aged at 130C in high temperature chamber. Note: T hermal Conductivity for aging tested using the QTM-500 Hot Wire Test Method. Values can differ from an ASTM-D5470 TM due to TM differences. (2) Compression (%)