Technical Data September 2014 3M Thermally Conductive Silicone Interface Pads 5591 and 5591S Product Description 3M Thermally Conductive Silicone Interface Pad 5591 and 5591S are highly conformable, slightly tacky silicone elastomer pads. These interface pads are designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. Features and Benefits Good thermal stability of the base polymer with excellent softness of the thermal pad. Good thermal conductivity in an ultra soft silicone polymer base. The product tack is such that a mechanical means to support the pad in a final assembly is required. Product Construction 3M Thermally Conductive Silicone Interface Pad 5591 and 5591S Color White Pad Type Filled Silicone Polymer Pad Thickness* 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm Primary Filler Type Ceramic Top Liner / 5591S Film Type 3M pad 5591S 12 m PET Film (film stays with pad) Base Liner 4 mils (100 m) Transparent PET / Optionally, 60 m Release Liner Thickness / Type Embossed PE film with transparent blue color is available. *Note: 3 M pad 5591 not available in 0.5 mm thickness. Optional thickness > 2.0 mm are available. Contact your 3M representative for more information. Polyester Film (12 m) = 3M pad 5591S (No film carrier on 3M pad 5591) Filled Silicone Elastomer Release Liner 3M Thermally Conductive Silicone Interface Pads 5591 and 5591S Typical Physical Properties and Performance Characteristics Note: T he following technical information and data should be considered representative or typical only and should not be used for specification purposes. Property Value Method 1 Product Number 3M Thermally Conductive Silicone Interface Pads 5591 and 5591S 3M Test Method Thermal Conductivity (W/m-K) 1.0 W/m-K with low pressure (<10 psi) -60C to 130/140C Long Term (Weeks-Months) 2 Operating Temperature Range 3M Test Method -60C to 160/180C Short Term (Hours-Days) Shore 00 results depend on test method and thickness of the sample tested. Typical results are in the 10-15 Shore 00 Modified 3 Hardness Shore 00 ASTM D2240 range 6 mm test thickness without the PET film. Ask 3M for more details on pad softness. 3M TM Dielectric Breakdown 200 V/mil AC (3M pad 5591S tested) (ASTM D149) 12 Volume Resistivity 2 x 10 Ohms (3M pad 5591S tested) ASTM D257 3M pad 5591 has not been tested for UL N/A Flammability Rating 3M pad 5591S tested: UL 94 V-1 (0.5mm) and UL-94 UL 94 V-1 (1.0mm - 5.0mm) Notes: 1 3 M pad 5591S has a 12 micrometer PET Film added to provide for a non-tacky surface, increased puncture resistance, and ease of handling and rework. 2 P otential Operating Temperature Range (C). End use application testing will determine final temperature range based on final design and other environmental conditions. Suggested temperature range is based on a 3M Test Method. 3 3M pad 5591S tested with-out PET film on product. Application Guidelines Substrate surfaces should be clean and dry prior to the thermal pad application to help ensure best thermal performance. A clean surface can improve the thermal performance of an application. 1) I sopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface contamination such as dust or fingerprints. Do not use denatured alcohol or glass cleaners, which often contain oily components. Allow the surface to dry for several minutes before applying the thermal pad. More aggressive solvents (such as acetone, methyl ethyl ketone (MEK) or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above. Note: B e sure to read and follow the manufacturers precautions and directions when using solvents. 2) A pply the thermal pad to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the thermal pad during its application. Remove the release liner before application. 3) A ssemble the part by applying compression to the substrates to help ensure a good wetting of the substrate surfaces with the thermal pads. Rigid substrates are more difficult to assemble without air entrapment as most rigid parts are not flat. Flexible substrates can be assembled to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrate can conform to the other substrates during application. (2)