5595 3M

Technical Data July, 2010 3M Thermally Conductive Interface Pads 5595 and 5595S Product Description 3M Thermally Conductive Interface Pads 5595 and 5595S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices. The specialized silicone chemistry of Interfacel Pads 5595 and 5595S provides for good thermal stability of the base polymer with excellent softness of the thermal pad. Interface Pad 5595 offers good thermal conductivity in a soft silicone polymer base. Interface Pad 5595S has a permanent PEN film 9 micrometer thick on one side to provide for a non-tacky surface, increased puncture resistance, ease of handling and rework. Interface Pads 5595 and 5595S have a tacky feel. The product tack is such that a mechanical means to support the pad in a final assembly is required. Product Construction 3M Thermally Conductive Interface Pads 5595 and 5595S Color Grey Pad Type Filled Silicone Polymer Pad Thickness 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm (>2 mm thickness available. Please inquire.) Primary Filler Type Ceramic Top Liner / Film Type Interface Pad 5595 Silicone Coated Polyester removable Liner / Interface Pad 5595S 9 m PEN Film Base Liner Thickness Base Liner 3 mils (75 m) Polyethylene Naphthalate (PEN) film (9 m) = Interface Pad 5595S or Interface Pad 5595 with release liner Filled Silicone Elastomer Release Liner 3 3M Thermally Conductive Interface Pads 5595 and 5595S Typical Physical Properties and Performance Characteristics Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Property Method Value Product Number* 3M Thermally Conductive Interface Pads 5595 and 5595S Thermal Conductivity (W/m-K) 1.6 W/m-K 3M Test Method with low pressure (<10 psi) Operating Temperature Range**** -60 to 125C 3M Test Method Shelf Life Product shelf life is 24 months from date of manufacture when 3M Test Method stored at room temperature conditions (23-25C & 50% RH) and in the products original packaging. Hardness Shore 00** Shore 00 results depend on test method and thickness of the Modified sample tested. Typical results are in the 50-60 Shore 00 ASTM D2240 range 6 mm test thickness without the PEN film. Ask 3M for more details on pad softness. Dielectric Breakdown 400 V/mil AC (Interface Pad 5595S tested) 3M TM (ASTM D149) 12 Volume Resistivity 5 x 10 Ohms (Interface Pad 5595S tested) ASTM D257 Flammability Rating*** UL-94-V0 (3M tested.) UL-94-V0 TM Note: *Interface Pad 5595S has a 9 micrometer PEN Film added to provide for a non-tacky surface, increased puncture resistance, ease of handling and rework. **Interface Pad 5595 tested with-out PET film on product. ***9 m PEN film is a non-FR version. ****Potential Operating Temperature Range (C). End use application testing will determine final temperature range based on final design and other environmental conditions. Suggested Temperature range is based on a 3M Test Method. Application Guidelines Substrate surfaces should be clean and dry prior to the thermal pad application to ensure best thermal performance. A clean surface can improve the thermal performance of an application. 1.) Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface contamination such as dust or fingerprints. Do not use denatured alcohol or glass cleaners, which often contain oily components. Allow the surface to dry for several minutes before applying the thermal pad. More aggressive solvents (such as acetone, methyl ethyl ketone (MEK) or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above. Note: Be sure to read and follow the manufacturers precautions and directions when using solvents. 2.) Apply the thermal pad to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the thermal pad during its application. Remove the release liner before application. 3.) Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the thermal pads. Rigid substrates are more difficult to assemble without air entrapment as most rigid parts are not flat. Flexible substrates can be assembled to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrate can conform to the other substrates during application. (2)