TECHNICAL DATASHEET SIL-FREE PLUS ADVANTAGES PRODUCT DESCRIPTION Sil-Free Plus is a non-silicone thermal Silicone-based compounds have an grease with the current lowest thermal undesirable tendency to physically migrate and contaminate components resistance on the market (for thin bond line applications*). Sil-Free Plus is also nearby. This interferes with circuit operation long after hardware installation extremely durable and will not pump-out making it ideal for applications requiring to cause unexpected, untimely and often extended life and no degradation. inaccessible problems. The Heat Sink Compounds no creep feature extends *For larger gaps/thicker films use a high circuit life by protecting components longer and by eliminating premature thermal conductivity material such as Sure- form gap filler failure of adjacent components caused by migrating silicone base fluid. Lorem ipsum PART NUMBER STRUCTURE TYPE VOLUME 454 g (16 oz.) JAR 104100F00000G 104000F00000G 142 g (5 oz.) TUBE 103900F00000G 340 g (12 oz.) CARTRIDGE 103800F00000G TUBE 57 g (2 oz.) 42.5 g (1.5 oz.) 103700F00000G SYRINGE NOTICE: The information included in this data sheet is believed to be accurate and reliable. BOYD Corporation assumes no responsibility for end use applications and no performance warranty is expressed or implied. Visit Us At www.boydcorp.com customerservice boydcorp.com BC 2020.5 TECHNICAL DATASHEET SIL-FREE PLUS APPLICATIONS BENEFITS Sil-Free Plus is designed to be applied where Sil-Free Plus is non-silicone based, non-reactive, thermal coupling is required and where a device and non-abrasive with a soft, grease-like may need to be removed from the heat sink at consistency with thixotropic behavior. It has a later time. Major applications include CPU/ excellent dielectric properties, lowest thermal GPU, power semiconductors and LED s. It is also resistance and superior durability (will not the most efficient and cost effective low bond pump-out). line TIM 2 for use in any thermal management application PROPERTY VALUE TEST METHOD 3 ASTM D-70 Specific Gravity, 25C Bleed, 200 C, 24 Hrs., %/Wt 0.00% FTM-321 MODIFIED Viscosity, 1 sec-1 , 25C/50C 470,000/410,000 cP ARES RHEOMETER Evaporation, 200 C, 24 Hrs., %/Wt. 1.00% FTM-321 MODIFIED 1.4 W/m-K Thermal Conductivity, 36C ASTM D5470-06 Thermal Resistance, 50C 0.0310 C/W Oracle TTV Model 270-7806-01 < 0.3 mils Anticipated Bond Line Thickness (mils) Electrical Properties 265 ASTM D-149 Dielectric Strength, 0.05 gap, V/mil Lorem ipsum Dielectric Constant, 25C 1,000 Hz 5.02 ASTM D-150 Dissipation factor, 25C 1,000 Hz 0.0022 ASTM D-150 15 ASTM D-257 Volume Resistivity, ohm-cm 2.0 X10 -40C to 180C Operating Temperature Range Flow Rate 7 to 10 g/min AZ Method Appearance Smooth White Paste Shelf Life 2 Years NOTICE: The information included in this data sheet is believed to be accurate and reliable. BOYD Corporation assumes no responsibility for end use applications and no performance warranty is expressed or implied. Visit Us At www.boydcorp.com customerservice boydcorp.com BC 2020.5