DATASHEET BoardLevelCoolingExtruded5000 BOARDLEVELCOOLINGExtruded5000 Extruded5000isaseriesofdualradialboardlevelheatsinksdesignedtocool TO218,TO220,andTO247devices.Representativeimageonly. ORDERINGINFORMATION PartNumber DeviceType 513001B02500G TO218,TO247 513002B02500G TO220 513002B32500G TO220 513102B02500G TO220 513201B02500G TO218 513202B02500G TO220 513301B02500G TO218,TO247 HEATSINKDETAILS Property Details Property Details Material Aluminum HeatSinkLength(mm) 12.70 Finish BlackAnodize HeatSinkWidth(mm) 34.92 DeviceAttachmentOptions Screw&Nut,MountingKit HeatSinkHeight(mm) SeeDimABelow BoardAttachmentOptions SolderablePins XDimension(mm) 12.70 ThermalInterfaceMaterial YDimension(mm) 0.79 ZDimension(mm) 2.67 HeatSinkMountingDirection Horizontal,Vertical MECHANICAL&PERFORMANCE Drawingdimensionsareshowninmm,(in) PartNumber ADim BDim CDim 513001B02500G 25.40 21.59 3.66 513002B02500G 25.40 18.29 3.18 513002B32500G 25.40 513102B02500G 38.10 18.29 3.18 MountingDetails: 513201B02500G 12.70 513202B02500G 50.80 18.29 3.18 513301B02500G 63.50 21.59 3.66 BoardLevelCooling www.boydcorp.com BC122020DATASHEET BoardLevelCoolingExtruded5000 PartNumbers:513002B02500G, PartNumbers:513001B02500G, 513201B02500G,513301B02500G 513102B02500G,513202B02500G PartNumber:513002B32500G BoardLevelCooling www.boydcorp.com BC122020