DATASHEET BoardLevelCoolingExtruded5310 BOARDLEVELCOOLINGExtruded5310 Extruded5310isaseriesofdualradialboardlevelheatsinksdesignedtocool TO202andTO220devices.Representativeimageonly. ORDERINGINFORMATION PartNumber DeviceType 531002B00000G TO202,TO220 531002B02100G TO202,TO220 531002B02500G TO220 531102B00000G TO202,TO220 531102B02100G TO220 531102B02500G TO220 531102V02500G TO220 531202B00000G TO202,TO220 531202B02100G TO202,TO220 531202B02500G TO202,TO220 531302B02500G TO202,TO220 HEATSINKDETAILS Property Details Property Details HeatSinkWidth(mm) 34.92 Material Aluminum HeatSinkLength(mm) 12.70 Finish BlackAnodize HeatSinkHeight(mm) SeeHDimbelow Finish:531102V02500G AavSHIELD3 HeatSinkMountingDirection Vertical DeviceAttachmentOptions RequiresMountingKit ThermalInterfaceMaterial MECHANICAL&PERFORMANCE PartNumber:531002B00000G Drawingdimensionsareshowninmm,(in) H PartNumber HDim XDim YDim ZDim 531002B00000G 25.40 531002B02100G 25.40 12.70(0.500) .79(0.031) 2.67(0.105) 531002B02500G 25.40 12.70(0.500) .79(0.031) 2.67(0.105) 531102B00000G 38.10 531102B02100G 38.10 12.70(0.500) .79(0.031) 2.67(0.105) 531102B02500G 38.10 12.70(0.500) .79(0.031) 2.67(0.105) 531102V02500G 38.10 12.70(0.500) .79(0.031) 2.67(0.105) 531202B00000G 50.80 531202B02100G 50.80 12.70(0.500) .79(0.031) 2.67(0.105) 531202B02500G 50.80 12.70(0.500) .79(0.031) 2.67(0.105) 531302B02500G 63.50 12.70(0.500) .79(0.031) 2.67(0.105) BoardLevelCooling www.boydcorp.com BC122020DATASHEET BoardLevelCoolingExtruded5310 PartNumber:531002B02100G PartNumber:531102B02100G H H PartNumber:531002B02500G PartNumber:531102B00000G PartNumber531202B00000G H BoardLevelCooling www.boydcorp.com BC122020