BGA-STD-050 ABL Heatsinks

* All ABL s BGA heatsinks are supplied with thermal tape Width Length Height Pad C/W C/W Model mm mm mm Size Wire Form Natural Forced mm 2M/s BGA-STD-010 13.5 13.0 10.0 12x12 - 27.00 14.50 BGA-STD-015 14.0 14.0 10.0 18x18 - 26.50 14.00 BGA-STD-020 21.0 21.0 9.0 20X20 - 24.50 13.00 BGA-STD-025 23.0 23.0 6.0 20x20 - 22.00 10.50 BGA-STD-030 27.0 27.0 6.0 20x20 WF700/WF300 20.00 10.00 BGA-STD-035 26.0 26.0 8.0 20x20 WF700/WF300 18.50 9.70 BGA-STD-040 27.0 27.0 6.0 20x20 WF700/WF300 16.00 10.20 BGA-STD-045 23.0 23.0 18.0 20x20 WF700/WF300 14.70 7.30 *BGA-STD-050 20.0 20.0 19.1 18x18 - 14.00 5.80 BGA-STD-055 25.9 23.9 10.0 20x20 WF700/WF300/WF151 14.00 6.00 BGA-STD-060 40.0 40.0 10.0 30x30 - 13.50 7.50 BGA-STD-065 27.8 27.8 11.2 20x20 WF700/WF300 12.20 5.80 BGA-STD-070 40.0 40.0 25.0 30x30 WF700/WF300/WF151 11.50 6.00 BGA-STD-075 40.0 40.0 23.0 18x18 WF700/WF300/WF151 11.00 5.60 BGA-STD-080 27.0 27.0 25.0 20x20 WF700/WF300/WF151 10.50 4.50 BGA-STD-085 30.7 30.7 14.1 20x20 WF700/WF300 10.00 5.20 BGA-STD-090 40.0 23.9 10.0 20x20 - 10.00 5.20 BGA-STD-095 40.0 40.0 10.0 18x18 WF700/WF300 9.70 4.00 BGA-STD-100 38.1 38.1 16.0 30x30 - 9.20 4.10 BGA-STD-105 35.0 35.0 18.0 30x30 WF700/WF300/WF151 9.20 5.20 BGA-STD-110 35.0 35.0 25.0 30x30 WF700/WF300/WF151 8.50 5.00 BGA-STD-115 40.0 40.0 18.0 30x30 WF700/WF300/WF151 8.20 5.10 BGA-STD-120 40.6 38.8 30.5 30x30 - 7.00 3.70 Thermally Conductive Aluminium Foil Tape All ABL s BGA heatsinks are supplied with thermal tape. With excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic Colour - White encapsulated components. Backing Type / Thickness Mm Aluminium Foil / 0.10 It consists of an aluminium foil backing Adhesive Type / Thickness Mm Arylic 0.075 (on clear liner side) coated, on both sides, with a very high Total Thickness mm 0,27 temperature resistance acrylic adhesive. Due to its high heat performance and adhesive Adhesion Kg/25mm 1,5 properties this tape can also be use to attach Thermal Conductivity W/m-K 0,95 components to a vertical heatsink and to 2 Thermal Resistance 0,2 C-in /W metal enclosure surfaces. Holding Power 23C Hour >72 Holding Power 130C Hour >2 X-ON Electronics Largest Supplier of Electrical and Electronic Components Click to view similar products for abl heatsinks manufacturer: Other Similar products are found below : 350AB2000B 173AB2000B 325AB1000B 150AB2000B BGA-PP-025 BGA-STD-050 350AB1500B BGA-STD-020 325AB1500B 205AB1000B BGA-STD-115 205AB1500B LS300 350AB1000B 345AB1000B 520AB0750MB(T03) LS305 205AB0500B PPL0500B BGA-STD-010 515AB0750MB(T03) PPN0750B PPL1000B PPN0500B BGA-STD-015