3.2 mm x 5.0 mm Ceramic Package SMD TCXO I533/1534/1733/1734 Series Product Features: Applications: Low Jitter, Non-PLL Based Output Server & Storage Available in Both Clipped Sinewave and Sonet /SDH HCMOS Output Levels 802.11 / Wifi 5.0 4 3 Compatible with Leadfree Processing T1/E1, T3/E3 Fibre Channel 3.2 Frequency 8.000 Mhz to 40 Mhz 1 2 Output Level Clipped Sinewave 0.8 V p-p Min. HCMOS 0 = 0.1 Volts max 1.5 1=2.64 Volts min or 80% of Vcc. Output Load Clipped Sinewave 10K Ohms / 10 pF HCMOS 15pF 2.6 1 2 Duty Cycle (HCMOS) 50% 10% Rise / Fall Time 10 nS Max. 4 3 (HCMOS) 1.4 Frequency Stability Vs Temperature See Frequency Stability Table Vs Voltage 0.3 ppm Max. Vs Load(5%) .0.2 ppm Max. 4.0 Frequency Tolerance 1.0 ppm 4 3 25 C 1.35 Aging 2.5 1 ppm / Year Max. 1 2 Supply Voltage See Supply Voltage Table , tolerance 5% 1.6 Current 2.0 mA Max. (Clipped Sinewave) 6.0 mA Max. (HCMOS) Pin Connection Voltage Control 1.5 VDC 1.0 VDC, 5.0 ppm Min. 1 Control Voltage or N.C. (I733/I734) 2 GND Operating See Operating Temperature Table 3 Output 4 Vcc Storage -40 C to +85 C Dimension Units: mm Phase Noise -86 dBc/Hz 10 Hz (typ. 20Mhz) -115 dBc/Hz 100 Hz -138 dBc/Hz 1KHz -146 dBc/Hz 10 Khz Part Number Guide Sample Part Number: I537-1Q3-20.000 Mhz Package Operating Temperature FrequencyStability vs Temperature Supply Voltage Frequency 3 = 3.3 V 7 = 0 C to +50 C **N = 1.0 ppm I533 (Clipped Sinewave TCXO) 1 = 0 C to +70 C **O = 1.5 ppm 7 = 3.0 V I534 (HCMOS TCXO) I733 (Clipped Sinewave TCVCXO) 2 = 2.7 V 3 = -20 C to +70 C **P = 2.0 ppm - 20.000 MHz I734 (HCMOS TCVCXO) 2 = -40 C to +85 C Q = 2.5 ppm R = 3.0 ppm J = 5.0 ppm NOTE: A 0.01 F bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. ** Not available for all temperature ranges. ILSI America Phone: 775-851-8880 Fax: 775-851-8882 e-mail: e-mail ilsiamerica.com www.ilsiamerica.com 06/25/14 F Specifications subject to change without notice 3.2 mm x 5.0 mm Ceramic Package SMD TCXO I533/1534/1733/1734 Series Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metallization). Tape and Reel Information: Quantity per 1000 Reel A 8 +/-.3 B 4 +/-.2 C 3.5 +/-.2 D 9 +/-1 or 12 +/-3 E 60 / 80 F 180 Environmental Specifications Thermal Shock MIL-STD-883, Method 1011, Condition A Moisture Resistance MIL-STD-883, Method 1004 Mechanical Shock MIL-STD-883, Method 2002, Condition B Mechanical Vibration MIL-STD-883, Method 2007, Condition A Resistance to Soldering Heat J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Hazardous Substance Pb-Free / RoHS / Green Compliant Solderability JESD22-B102-D Method 2 (Preconditioning E) Terminal Strength MIL-STD-883, Method 2004, Test Condition D Gross Leak MIL-STD-883, Method 1014, Condition C Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s Solvent Resistance MIL-STD-202, Method 215 Marking Line 1: I - Date Code (YWW) Line 2: Frequency ILSI America Phone: 775-851-8880 Fax: 775-851-8882 e-mail: e-mail ilsiamerica.com www.ilsiamerica.com 06/25/14 F Specifications subject to change without notice