4 Pad Ceramic Package, 2 mm x 2.5 mm ILCX18 Series Product Features: Applications: SMD Package PCMCIA Cards Small package Foot Print Storage Supplied in Tape and Reel PCs 2.5 +/-0.1 Compatible with Leadfree Processing Wireless Lan 4 3 USB GSM Cell Phone 2.0 +/-0.1 2 1 Frequency 12 MHz to 60 MHz* 0.55 +/-0.1 ESR (Equivalent Series Resistance) 1 2 12 MHz 19.9 MHz 100 Max. 20 MHz 29.9 MHz 80 Max. 30 MHz 39.9 MHz 60 Max. 40 MHz 60.0 MHz 40 Max. 4 3 Connection diagram Shunt Capacitance (C0) 3.5 pF Max. 3 4 Frequency Tolerance 25 C 30 ppm Standard (see Part Number Guide for more options) Frequency Stability over 50 ppm Standard (see Part Number Guide for more options) Temperature 1 2 Crystal Cut AT Cut Load Capacitance 18 pF Standard (see Part Number Guide for more options) Recommended pad layout 0.9 Drive Level 100 W Max. 0.8 Aging 5 ppm Max. / Year Standard 1.25 Temperature 1.65 0 C to +70 C Standard (see Part Number Guide for more Operating options) Dimension Units: mm Storage -40 C to +85 C Standard Part Number Guide Sample Part Number: ILCX18 - FB1F18 - 20.000 Package Tolerance Stability Operating Mode Load Frequency (overtone) Capacitance (ppm) at Room (ppm) over Operating Temperature Range (pF) Temperature Temperature B = 50 ppm B = 50 ppm 0 = 0C to +50C F = 30 ppm F = 30 ppm 1 = 0C to +70C G = 25 ppm G = 25 ppm 2 = -10C to +60C H = 20 ppm H = 20 ppm 3 = -20C to +70C 18 pF Standard ILCX18 - F = Fundamental - 20.000 MHz Or Specify I = 15 ppm I = 15 ppm** 5 = -40C to +85C J = 10 ppm* J = 10 ppm** 9 = -10C to +50C D = -10C to +105C* E = -40C to +105C* * Not available at all frequencies. ** Not available for all temperature ranges. ILSI America Phone: 775-851-8880 Fax: 775-851-8882 e-mail: e-mail ilsiamerica.com www.ilsiamerica.com 7/23/12 D Specifications subject to change without notice Page 1 4 Pad Ceramic Package, 2 mm x 2.5 mm ILCX18 Series Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal). Tape and Reel Information: Quantity per 1000 Reel A 8 +/-.3 B 4 +/-.2 C 3.5 +/-.2 D 9 +/-1 or 12 +/-3 E 60 / 80 F 180 Environmental Specifications Thermal Shock MIL-STD-883, Method 1011, Condition A Moisture Resistance MIL-STD-883, Method 1004 Mechanical Shock MIL-STD-883, Method 2002, Condition B Mechanical Vibration MIL-STD-883, Method 2007, Condition A Resistance to Soldering Heat J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Hazardous Substance Pb-Free / RoHS / Green Compliant Solderability JESD22-B102-D Method 2 (Preconditioning E) Terminal Strength MIL-STD-883, Method 2004, Test Condition D Gross Leak MIL-STD-883, Method 1014, Condition C Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s Solvent Resistance MIL-STD-202, Method 215 Marking Line 1: I-Date Code(yww) Line 2: Frequency ILSI America Phone: 775-851-8880 Fax: 775-851-8882 e-mail: e-mail ilsiamerica.com www.ilsiamerica.com 7/23/12 D Specifications subject to change without notice Page 2