2.0 mm x 2.5 mm Ceramic Package SMD Oscillator, TTL / HC-MOS ISM95 Series Product Features: Applications: Low Jitter, Non-PLL Based Output Fibre Channel 2. 5 CMOS/TTL Compatible Logic Levels Server & Storage Compatible with Leadfree Processing Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 2.0 System Clock Frequency 1.000 MHz to 60.000 MHz Output Level HC-MOS 0 = 0.1 Vcc Max., 1 = 0.9 Vcc Min. TTL 0 = 0.4 VDC Max., 1 = 2.4 VDC Min. Duty Cycle Specify 50% 10% or 5% See Table in Part Number Guide Rise / Fall Time 5 nS Max. Vcc = +3.3 VDC, 10 nS Max. Vcc = +5 VDC *** Output Load Fo < 50 MHz = 10 TTL, Fo > 50 MHz = 5 LSTTL See Table in Part Number Guide Frequency Stability See Frequency Stability Table (Includes room temperature tolerance and stability over operating temperature) 0.6 Start-up Time 10 mS Max. Enable / Disable 100 nS Max. N.C. or 70% Vdd = Enable. 30% Vdd = Disable. Time Recommended Pad Layout Supply Voltage See Input Voltage Table, tolerance 5 % Current 25 mA Max. *** Operating See Operating Temperature Table in Part Number Guide Storage -55 C to +125 C Jitter: RMS(1sigma) 1 MHz-60 MHz 5 pS RMS (1 sigma) Max. accumulated jitter (20K adjacent periods) Pin Connection Max Integrated 1 Enable 2 GND 1 MHz-60 MHz 1.5 pS RMS (1 sigma -12KHz to 20MHz) 3 Output 4 Vcc Max Total Jitter 1 MHz-60 MHz 50 pS p-p (100K adjacent periods) Dimension Units: mm Part Number Guide Sample Part Number: ISM95 - 3251BH - 20.000 Package Input Operating Symmetry Output Stability Enable / Frequency Disable Voltage Temperature (Duty Cycle) (in ppm) 5 = 5.0 V 1 = 0 C to +70 C 5 = 45 / 55 Max. 1 = 10TTL / 15 pF HC-MOS **A = 25 H = Enable ISM95 - - 20.000 MHz 3 = 3.3 V 6 = 40 / 60 Max. 6 = 30 pF O = N/C 8 = -10 C to +60 C B = 50 7 = 3.0 V 6 = -10 C to +70 C 5 = 50 pF HC-MOS (<40 MHz) C = 100 2 = 2.7 V 3 = -20 C to +70 C 6 = 2.5 V 4 = -30 C to +75 C 1 = 1.8 V* 2 = -40 C to +85 C NOTE: A 0.01 F bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. * Not available at all frequencies. ** Not available for all temperature ranges. *** Frequency, supply, and load related parameters. ILSI America Phone: 775-851-8880 Fax: 775-851-8882 e-mail: e-mail ilsiamerica.com www.ilsiamerica.com 06/09 A Specifications subject to change without notice Page 1 2.0 mm x 2.5 mm Ceramic Package SMD Oscillator, TTL / HC-MOS ISM95 Series Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Quantity per 1000 Reel A 8 +/-.3 B 4 +/-.2 C 3.5 +/-.2 D 9 +/-1 or 12 +/-.3 E 60 / 80 F 180 Environmental Specifications Thermal Shock MIL-STD-883, Method 1011, Condition A Moisture Resistance MIL-STD-883, Method 1004 Mechanical Shock MIL-STD-883, Method 2002, Condition B Mechanical Vibration MIL-STD-883, Method 2007, Condition A Resistance to Soldering Heat J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Hazardous Substance Pb-Free / RoHS / Green Compliant Solderability JESD22-B102-D Method 2 (Preconditioning E) Terminal Strength MIL-STD-883, Method 2004, Test Condition D Gross Leak MIL-STD-883, Method 1014, Condition C Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s Solvent Resistance MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code (YWW) Line 2: Frequency ILSI America Phone: 775-851-8880 Fax: 775-851-8882 e-mail: e-mail ilsiamerica.com www.ilsiamerica.com 06/09 A Specifications subject to change without notice Page 2