2.5 mm x 3.2 mm Ceramic Package SMD Oscillator, TTL / HC-MOS ISM97 Series Product Features: Applications: Low Jitter, Non-PLL Based Output Fibre Channel CMOS/TTL Compatible Logic Levels Server & Storage Compatible with Leadfree Processing Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 System Clock Frequency 1.000 MHz to 152.250 MHz Output Level HC-MOS 0 = 0.1 Vcc Max., 1 = 0.9 Vcc Min. TTL 0 = 0.4 VDC Max., 1 = 2.4 VDC Min. Duty Cycle Specify 50% 10% or 5% See Table in Part Number Guide Rise / Fall Time 6 nS Max. Output Load See Table in Part Number Guide Frequency Stability See Frequency Stability Table (Includes room temperature tolerance and stability over operating temperature) Start-up Time 10 mS Max. Enable / Disable 100 nS Max. N.C. or 70% Vdd = Enable. 30% Vdd = Disable. Recommended Pad layout Time Supply Voltage See Input Voltage Table, tolerance 5 % 2.6 Current 25 mA Max. (5.0V) 20 mA Max. (1.8V-3.3V) 2.0 Operating See Operating Temperature Table in Part Number Guide 1.3 Storage -55 C to +125 C 1.4 Jitter: RMS(1sigma) Pin Connection 1 MHz-60 MHz 5 pS RMS (1 sigma) Max. accumulated jitter (20K adjacent periods) 1 Enable 2 GND Max Integrated 3 Output 1 MHz-60 MHz 1.5 pS RMS (1 sigma -12KHz to 20MHz) 4 Vcc Max Total Jitter Dimension Units: mm 1 MHz-60 MHz 50 pS p-p (100K adjacent periods) Part Number Guide Sample Part Number: ISM97 - 3251BH - 20.000 Package Input Operating Symmetry Output Stability Enable / Frequency Disable Voltage Temperature (Duty Cycle) (in ppm) 5 = 5.0 V 1 = 0 C to +70 C 5 = 45 / 55 Max. 1 = 10TTL / 15 pF HC-MOS **E = 10 H = Enable O = N/C 3 = 3.3 V 6 = -10 C to +70 C 6 = 40 / 60 Max. 6 = 30 pF **D = 15 ISM97 - 7 = 3.0 V 3 = -20 C to +70 C 5 = 50 pF HC-MOS (<40 MHz) **F = 20 - 20.000 MHz 2 = 2.7 V 4 = -30 C to +75 C **A = 25 6 = 2.5 V 2 = -40 C to +85 C B = 50 1 = 1.8 V* C = 100 NOTE: A 0.01 F bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. * Not available at all frequencies. ** Not available for all temperature ranges. *** Frequency, supply, and load related parameters. ILSI America Phone: 775-851-8880 Fax: 775-851-8882 e-mail: e-mail ilsiamerica.com www.ilsiamerica.com 08/13/13 C Specifications subject to change without notice Page 1 2.5 mm x 3.2 mm Ceramic Package SMD Oscillator, TTL / HC-MOS ISM97 Series Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Quantity per 1000 Reel A 8.0 +/-.2 B 4.0 +/-.2 C 5.5 +/-.1 D 9.0 +/-1 E 50 / 60 / 80 F 180 Environmental Specifications Thermal Shock MIL-STD-883, Method 1011, Condition A Moisture Resistance MIL-STD-883, Method 1004 Mechanical Shock MIL-STD-883, Method 2002, Condition B Mechanical Vibration MIL-STD-883, Method 2007, Condition A Resistance to Soldering Heat J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Hazardous Substance Pb-Free / RoHS / Green Compliant Solderability JESD22-B102-D Method 2 (Preconditioning E) Terminal Strength MIL-STD-883, Method 2004, Test Condition D Gross Leak MIL-STD-883, Method 1014, Condition C Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s Solvent Resistance MIL-STD-202, Method 215 Marking Line 1: ILSI, Date Code (YWW) Line 2: Frequency ILSI America Phone: 775-851-8880 Fax: 775-851-8882 e-mail: e-mail ilsiamerica.com www.ilsiamerica.com 08/13/13 C Specifications subject to change without notice Page 2