cExpress-BT-E3825 ADLINK Technology

cExpress-BT COM Express Compact Size Type 6 Module with Intel Atom E3800 series or Celeron Processor SoC Features Single, dual, quad-core Intel Atom or Celeron Processor SoC Up to 8GB Dual Channel DDR3L at 1333MHz VGA and two DDI channels (build option LVDS) Three PCIe x1, GbE Two SATA 3Gb/s, one USB 3.0, seven USB 2.0 Supports Smart Embedded Management Agent (SEMA ) functions Extreme Rugged operating temperature: -40C to +85C (build option) Specifications Core System Video CPU GPU Feature Support Single, dual, quad-core Intel Atom or Celeron Processor 7th generation Intel graphics core architecture with four execution units Atom E3845 1.91 GHz 542/792 (Turbo) 10W (4C/1333) supporting two independent displays Atom E3827 1.75 GHz 542/792 (Turbo) 8W (2C/1333) 3D graphics hardware acceleration Atom E3826 1.46 GHz 533/667 (Turbo) 7W (2C/1066) Supports DirectX 11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2 Atom E3825 1.33 GHz 533 (No Turbo) 6W (2C/1066) Video decode hardware acceleration including support for H.264, MPEG2, Atom E3815 1.46 GHz 400 (No Turbo) 5W (1C/1066) MVC, VC-1, WMV9 and VP8 formats Atom E3805 1.33 GHz (No GFX) 3W (2C/1066) Celeron N2930 1.83/2.16 (Burst) GHz, 313/854 (Turbo) 7.5W (4C/1333) Video encode hardware acceleration including support for H.264, MPEG2 and Celeron J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W (4C/1333) MVC formats Supports: Single, dual or quad Out-of-Order Execution (OOE) processor Digital Display Interface cores, Intel VT-x, Intel SSE4.1 and SSE4.2, Intel 64 architecture, IA 32-bit , PCLMULQDQ Instruction DRNG, Intel Thermal Monitor (TM1 & TM2) DDI1 supporting DisplayPort/HDMI/DVI (build option dual channel 18/24-bit Note: Availability of features may vary between processor SKUs. LVDS support) DDI2 supporting DisplayPort/HDMI/DVI Memory Dual channel non-ECC 1333/1066 MHz DDR3L memory up to 8GB in dual VGA stacked SODIMM sockets Analog VGA supporting resolutions of up to 2560 x 1600 x 24bpp 60 Embedded BIOS Audio AMI EFI with CMOS backup in 8MB SPI BIOS Chipset Cache Intel HD Audio integrated in SoC Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way L1 write-back Audio Codec data cache Located on carrier Express-BASE6 2MB for E3845, N2930 and J1900 1MB for E3827, E3826, E3825 and E3805 Ethernet 512K for E3815 Intel MAC/PHY: Intel i210LM (MAC/PHY) Ethernet controller Expansion Busses Interface: 10/100/1000 GbE connection 3 PCI Express x1 Gen2 (AB): Ianes 0/1/2 build option PCIe x4 (lose GbE) LPC bus, SMBus (system), I2C (user) SEMA Board Controller Supports: Voltage/Current monitoring, Power sequence debug support, AT/ ATX mode control, Logistics and Forensic information, Flat Panel Control, 2 General Purpose I C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control Debug Headers 40-pin multipurpose flat cable connector Use in combination with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, Power test points, Debug LEDs 26-pin XDP header for ICE debug of CPU/chipset Note: build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these build option part numbers will need to be newly created and this will result in production lead times. Specifications I/O Interfaces Mechanical and Environmental USB: 1x USB 3.0 (USB 0) Specification: PICMG COM.0: Rev 2.1 Type 6 6x USB 1.1/2.0 (USB 1/2/3/4/5/6, ports 3-6 from USB hub) Form Factor: Compact size: 95 mm x 95 mm SATA: Two SATA 3 Gb/s ports Operating Temperature Serial: 2 UART ports COM 0/1 (COM 0 support console redirection) Standard: 0C to +60C eMMC: Build option soldered on module bootable eMMC flash storage Extreme Rugged: -40C to +85C (build option, Atom E38xx series only) 8 to 32 GB SDIO: On module mini SD card socket, eMMC feature may vary between OS Humidity GPIO: 4 GPO and 4 GPI 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Super I/O Shock and Vibration On carrier if needed (standard support for W83627DHG-P) IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, TPM Table 214-I, Condition D Chipset: Atmel AT97SC3204 (build option) Type: TPM 1.2 HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Power Operating Systems Standard Input: ATX = 12V5% / 5Vsb 5% or AT = 12V5% Wide Input: ATX = 5~20 V / 5Vsb 5% or AT = 5 ~20V Standard Support Management: ACPI 4.0 compliant, Smart Battery support Windows 7/8 32/64-bit, Linux 32/64-bit Power States: C0, C1, C1E, C4, C6 Extended Support (BSP) S0, S3, S4, S5 (Wake on USB S3 for port 0~7/S4 for port 0~3, WOL S3/S4/S5 WES7/8, Linux, VxWorks 32/64-bit WEC7 32-bit ECO mode: Wake on USB S3/S4, WOL S3/S4/S5 Note: Build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that part numbers for SKUs with build options will need to be created and may cause production lead times.