X-On Electronics has gained recognition as a prominent supplier of CM-920-TM-AL Heat Sinks across the USA, India, Europe, Australia, and various other global locations. CM-920-TM-AL Heat Sinks are a product manufactured by ADLINK Technology. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

CM-920-TM-AL ADLINK Technology

CM-920-TM-AL electronic component of ADLINK Technology
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Part No.CM-920-TM-AL
Manufacturer: ADLINK Technology
Category: Heat Sinks
Description: Heat Sinks AL PASSIVE HEATSPRDR FOR Core Module 920
Datasheet: CM-920-TM-AL Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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MOQ : 1
Multiples : 1
1 : USD 110.6631
10 : USD 110.6631
25 : USD 109.2047
N/A

Obsolete
   
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RoHS - XON
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We are delighted to provide the CM-920-TM-AL from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the CM-920-TM-AL and other electronic components in the Heat Sinks category and beyond.

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CM-920 Extreme Rugged PCI/104-Express Single Board Computer with 3rd Generation Intel Core Processor Features Dual-core 3rd Generation Intel Core Processor Up to 4GB industrial grade soldered-down ECC 1600MHz DDR3 memory 8GB industrial grade solid state drive (SSD) One PCIe x16 (Gen 3) and 1 x4 or 4 x1 (Gen 2) Two SATA 6 Gb/s ports, two Gigabit Ethernet, four USB 2 .0 interfaces, and two serial ports PCI/104-Express Type 1 and PCI/104 expansion interfaces Extreme Rugged operating temperature: 40C to +85C 50% thicker PCB for high vibration environments Specifications Core System Video CPU Integrated Graphics Intel Core i7-3517UE 1.7GHz (up to 2.8GHz Turbo), 4MB L3 cache, 17W, HD Graphics 4000 at 350-1000 MHz dual core Integrated Video Intel Celeron 807UE 1.0GHz, 1MB L3 cache, 10W, single core DirectX 11.0, OpenGL 3.1, and OCL 1.1 Memory Media Processing 2 or 4GB single channel industrial grade solder down ECC 1600 MHz DDR3 memory Decode (HW JPEG & MJPEG decode), encode (full HW MPEG2 encode), transcode Intel Clear Video HD Technology + enhanced media processing Embedded BIOS VGA Interface AMI UEFI with CMOS backup in 16 MB SPI flash Analog VGA support with 300 MHz DAC, Analog monitor support up to Hardware Monitor QXGA (2048 x 1536) and VGA hot plug Supply voltages and CPU temperature LVDS Interface Watchdog Timer Dual-channel 18/24-bit LVDS Programmable timer range to generate RESET Digital Display Interface Technologies One DVI PAVP 3.0, Intel AMT 8.0, Intel VT, Intel AES-NI, Intel HT, Intel HD Graphics with Dynamic Frequency, Intel Turbo Boost , Dynamic Turbo, Intel AVX 1.0, Power Intel Quick Sync Video Standard Input Expansion Busses 5V (3.3V and 12V if required by the PCI/104-Express stack) PCI/104 (32-bit 33/66MHz) Power States PCI/104-Express Type 1 with 1 of PCI Express x16 (Gen3) bus SMBus (system) Supports S1, S4 2 of USB 2.0, 4 of PCI Express x1 Power Consumption Ethernet 9W typical 10/100/1000Mbps 2x GbE: 1x PCH using Intel 82579 PHY, 1x Intel 82574 MAC/PHY Audio Chipset Integrated on Mobile Intel QM67 Express Chipset, available on HDMI portSpecifications I/O Interfaces Mechanical and Environmental Chipset Form Factor Integrated on Mobile Intel QM67 Express Chipset PCI/104 Express USB Dimension Four USB 2.0 ports (plus two to the PCI/104-Express stack) 116mm x 96mm SATA Operating Temperature Two SATA 6 Gb/s with support for RAID 0,1 Standard: -20C to +70C Extreme Rugged: -40C to +85C (CPU throttling at 800MHz, no throttling Storage to +75C) Onboard 8GB industrial grade SSD Storage Temperature Serial -55C to +85C Two RS-232 Serial ports implemented in LPC based Super I/O Humidity 90% at 60C non-condensing Operation System Standard Support Shock and Vibration Windows 7, Linux 50G peak-to-peak, 11ms duration, MIL-STD-202G Method 213B Operating: 11.96 Grms, 50-2,000 Hz, each axis, MIL-STD-202G Method 214A Extended Support (BSP) WES 7, WES 2009, WEC 7, VxWorks 6.9, QNX 6.5 HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Intelligent Middleware SEMA Local management, control of embedded computer systems Extended EAPI for monitoring, controlling and analytics applications Multiple OS support and across platforms (x86, ARM)

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