Express-CF/CFE th COM Express Basic Size Type 6 Module with Hexacore Mobile 8 Gen Intel Xeon and Core Processors Features PICMG COM.0 R3.0 Type 6 module with hexacore and quad-core Intel processors Up to 48GB Dual Channel DDR4 at 2133/2400MHz Three DDI channels, one LVDS (or 4 lanes eDP), supports up to 3 independent displays One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD & Intel Optane Memory Technology support) GbE, four SATA 6 Gb/s, four USB 3.1 and four USB 2.0 Supports Smart Embedded Management Agent (SEMA) functions Specifications Core System Video CPU GPU Feature Support Mobile 8th Generation Intel Xeon and Core Processors - 14nm process Intel Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI (or VGA), LVDS Xeon E-2176M, 2.7 (4.4)GHz, 12MB. 45W (35W cTDP), 6C/GT2 or eDP outputs Core i7-8850H, 2.6 (4.3)GHz, 9MB, 45W (35W cTDP), 6C/GT2 Hardware encode/transcode HD content (including HEVC 10-bit) Core i5-8400H, 2.5 (4.2)GHz, 8MB, 45W (35W cTDP), 4C/GT2 DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, Core i3-8100H, 3.0GHz, 6MB, 45W (35W cTDP), 4C/GT2 DirectX 10,DirectX 9 support Supports: Intel VT, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 OpenGL 4.5 support Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel TSX. OpenCL 2.1, 2.0/1.2 support Note: Availability of the features may vary between processor SKUs. Digital Display Interface Memory DDI1/2/3 supporting DisplayPort 1.2, HDMI 1.4, DVI 2133/2400 MHz DDR4 memory up to 48GB in three SODIMM sockets Notes: DP1.2: max. resolution is 4096x2304 60Hz, 24bpp (Xeon paired with CM246 supports both ECC and non-ECC memory) HDMI1.4: max. resolution is 4096x2160 24Hz, 24bpp (48GB is build support) VGA Embedded BIOS VGA support, in place of DDI3 channel (build option, max. resolution AMI EFI with CMOS backup in 32MB SPI BIOS with Intel AMT 12.0 support 1920x1200 60Hz) Cache LVDS 12MB for Xeon , 9MB for Core i7, 8MB for Core i5 Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 6MB for Core i3 1920x1200 60Hz in dual mode) Chipset eDP CM246 (supports ECC memory and Intel AMT) 4 lane support optional, in place of LVDS (build option, max. resolution QM370 (supports Intel AMT ) 4096x2304 60Hz, 24bpp) HM370 (no support for Intel AMT ) Audio Expansion Busses Chipset: Intel HD Audio integrated in chipset PCIe x16, 2 PCIe x8, or 1 PCIe x8 with 2 PCIe x4 (Gen3) 6 PCI Express x1 (Gen3) AB connector, Lanes 0/1/2/3/4/5 Audio Codec:located on carrier Express-BASE6 (ALC886 standard supported) 2 PCI Express x1 (Gen3) CD connector, Lane 6/7 2 LPC bus, SMBus (system), I C (user) Ethernet Intel I219LM/V with AMT 12.0 support (only LM version support AMT) SEMA Board Controller Interface: 10/100/1000 GbE connection Supports: voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, 2 general purpose I C, failsafe BIOS (dual BIOS ), watchdog timer and fan control Debug Headers 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset Note: build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these build option part numbers will need to be newly created and this will result in production lead times. Specifications Operating Systems Multi I/O and Storage Standard Support USB: 4x USB 3.1 (USB 0, 1, 2, 3) and 4x USB 2.0 (USB 4, 5, 6, 7) Windows 10 64-bit, Linux 64-bit SATA: Four ports SATA 6Gb/s (SATA0,1,2,3) Serial: 2 UART ports with console redirection Extended Support (BSP) GPIO/SD: 4 GPO and 4 GPI (GPI with interrupt) Linux 64-bit SD/GPIO muxed design, switched by BIOS setting SD functions as storage device only Mechanical and Environmental Note: USB 3.1 Gen2 support dependent on carrier design Form Factor: PICMG COM.0, Rev 3.0 Type 6 Dimension: Basic size: 125 mm x 95 mm Super I/O Supported on carrier if needed (standard support for W83627DHG-P) Operating Temperature Standard: 0C to 60C TPM Humidity Chipset: Infineon 5-90% RH operating, non-condensing Type: TPM 2.0 5-95% RH storage (and operating with conformal coating) Power Shock and Vibration Standard Input: ATX = 12V 5% / 5Vsb 5% or AT = 12V 5% IEC 60068-2-64 and IEC-60068-2-27 Wide Input: ATX = 8.5-20 V / 5Vsb 5% or AT = 8.5-20V MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Management: ACPI 5.0 compliant, Smart Battery support Table 214-I, Condition D Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, HALT WOL S3/S4/S5) Thermal Stress, Vibration Stress, Thermal Shock and Combined Test ECO mode: Supports deep S5 mode for power saving Notes: * All specifications are subject to change without further notice. * For CPU and chipset combinations not listed, please contact your ADLINK representative for availability.