Express-CFR COM Express Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel Xeon , Core, Pentium and Celeron Processors Features PICMG COM.0 R3.0 Type 6 module with 45W/25W hexacore and quad-core Intel processors Up to 96GB* Dual Channel DDR4 at 2133/2400 MHz in up to three SO-DIMM sockets (*under validation) Three DDI channels, one LVDS, supports up to 3 independent displays (VGA, eDP by build option) One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD & Intel Optane Memory Technology support) GbE, four SATA 6 Gb/s, four USB 3.1 and four USB 2.0 Supports Smart Embedded Management Agent (SEMA) functions Extreme Rugged operating temperature: -40C to +85C (build option, selected SKUs) Specifications Core System Chipset CPU CM246 (supports ECC memory and Intel AMT) Mobile 9th Generation Intel Xeon , Core, Pentium and Celeron QM370 (supports Intel AMT ) Processors - 14nm process HM370 (no support for Intel AMT ) Xeon E-2276ME 45W (35W cTDP), 6C/GT2 (ECC/non-ECC) Note: Chipset is same as Coffee Lake. Xeon E-2276ML 25W, 6C/GT2 (ECC/non-ECC) Xeon E-2254ME 45W (35W cTDP), 4C/GT2 (ECC/non-ECC) Expansion Busses Xeon E-2254ML 25W, 4C/GT2 (ECC/non-ECC) PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3) Core i7-9850HE 45W (35W cTDP), 6C/GT2 6 PCI Express x1 (Gen3) AB connector, Lanes 0/1/2/3/4/5 Core i7-9850HL 25W, 6C/GT2 2 PCI Express x1 (Gen3) CD connector, Lane 6/7 Core i3-9100HL 25W, 4C/GT2 (ECC/non-ECC) 2 LPC bus, SMBus (system), I C (user) Pentium G5600E 35W, 2C/GT1 (ECC/non-ECC) SEMA Board Controller Celeron G4930E 35W, 2C/GT1 (ECC/non-ECC) Supports: voltage/current monitoring, power sequence debug support, Celeron G4932E 25W, 2C/GT1 (ECC/non-ECC) Supports: Intel VT, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 AT/ATX mode control, logistics and forensic information, flat panel control, 2 Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel general purpose I C, failsafe BIOS (dual BIOS ), watchdog timer and fan AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel TSX. control Note: Availability of the features may vary between processor SKUs. Debug Headers Memory 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power Up to 96GB* 2133/2400 MHz DDR4 in three SODIMM sockets (*under testpoints, debug LEDs validation, max. 48GB verified) 60-pin XDP header for ICE debug of CPU/chipset (optional) (Xeon , Core i3, Pentium , Celeron paired with CM246 supports both ECC and non-ECC memory) (three sockets by build option) Embedded BIOS AMI EFI with CMOS backup in 32/16MB SPI BIOS with Intel AMT 12.0 support Cache 12MB for Xeon 6C, 8MB for Xeon 4C, 9MB for Core i7, 6MB for Core i3, 4MB for Pentium , 2MB for Celeron Note: build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these build option part numbers will need to be newly created and this will result in production lead times. Express-CFR Specifications Video Super I/O GPU Feature Support Supported on carrier if needed (standard support for W83627DHG-P) Intel Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI (or VGA), LVDS TPM or eDP outputs Chipset: Infineon Hardware encode/transcode HD content (including HEVC 10-bit) Type: TPM 2.0 DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10,DirectX 9 support Power OpenGL 4.5 support Standard Input: ATX = 12V 5% / 5Vsb 5% or AT = 12V 5% OpenCL 2.1, 2.0/1.2 support Wide Input: ATX = 8.5-20 V / 5Vsb 5% or AT = 8.5-20V Management: ACPI 5.0 compliant, Smart Battery support Digital Display Interface Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, DDI1/2/3 supporting DisplayPort 1.2, HDMI 1.4, DVI WOL S3/S4/S5) Notes: DP1.2: max. resolution is 4096x2304 60Hz, 24bpp ECO mode: Supports deep S5 mode for power saving HDMI1.4: max. resolution is 4096x2160 24Hz, 24bpp Operating Systems VGA Standard Support VGA support, in place of DDI3 channel (build option, max. resolution Windows 10 64-bit, Linux 64-bit, VxWorks 64-bit (TBD) 1920x1200 60Hz) Extended Support (BSP) LVDS Linux 64-bit, VxWorks 64-bit (TBD) Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200 60Hz in dual mode) Mechanical and Environmental eDP Form Factor: PICMG COM.0, Rev 3.0 Type 6 4 lane support optional, in place of LVDS (build option, max. resolution 4096x2304 60Hz, 24bpp) Dimension: Basic size: 125 mm x 95 mm Operating Temperature Audio Standard: 0C to 60C Chipset: Intel HD Audio integrated in chipset Extreme Ruggeed: -40C to +85C (build option for selected SKUs) Audio Codec:located on carrier Express-BASE6 (ALC886 standard supported) Humidity Ethernet 5-90% RH operating, non-condensing Intel I219LM/V with AMT 12.0 support (only LM version support AMT) 5-95% RH storage (and operating with conformal coating) Interface: 10/100/1000 GbE connection Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 Multi I/O and Storage MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, USB: 4x USB 3.1 (USB 0, 1, 2, 3) and 4x USB 2.0 (USB 4, 5, 6, 7) Table 214-I, Condition D SATA: Four ports SATA 6Gb/s (SATA0,1,2,3) Serial: 2 UART ports with console redirection HALT GPIO/SD: 4 GPO and 4 GPI (GPI with interrupt) Thermal Stress, Vibration Stress, Thermal Shock and Combined Test SD/GPIO muxed design, switched by BIOS setting SD functions as storage device only Note: USB 3.1 Gen2 support dependent on carrier design Notes: * All specifications are subject to change without further notice. * For CPU and chipset combinations not listed, please contact your ADLINK representative for availability.