Express-HL COM Express Basic Size Type 6 Module with 4th Generation Intel Core and Celeron Processors Features 4th Generation Intel Core and Celeron Processors with Intel QM87 and Intel HM86 Express Chipset Up to 16GB Dual Channel DDR3L at 1600MHz Three DDI ports support 3 independent displays Seven PCIe x1, one PCIe x16 GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0 Supports Smart Embedded Management Agent (SEMA ) functions Extreme Rugged operating temperature: -40C to +85C (build option) Specifications Core System Video CPU GPU Feature Support Generation 7.5 graphics core architecture, supporting 4th Generation Intel Core Processors (Mobile) - 22nm 3 independent and simultaneous display combinations of DisplayPort /HDMI i7-4860EQ 1.8 GHz (3.2 GHz Turbo), 47W (4C/GT3) / LVDS monitors i7-4700EQ 2.4 GHz (3.4 GHz Turbo), 47W (4C/GT2) i5-4400E 2.7 GHz (3.3 GHz Turbo), 37W (2C/GT2) Encode/transcode HD content i5-4402E 1.6 GHz (2.7 GHz Turbo), 25W (2C/GT2) Playback of high definition content including Blu-ray Disc i3-4100E 2.4 GHz (no Turbo) 3MB, 37W (2C/GT2) i3-4102E 1.6 GHz (no Turbo) 3MB, 25W (2C/GT2) Digital Display Interface Celeron 2000E 2.2 GHz (no Turbo) 35W (2C/GT1) DDI1 supporting DisplayPort / HDMI / DVI Celeron 2002E 1.5 GHz (no Turbo) 25W (2C/GT1) DDI2 supporting DisplayPort / HDMI / DVI Supports: Intel VT, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 DDI3 supporting DisplayPort / HDMI / DVI Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel VGA TSX. Note: Availability of the features may vary between processor SKUs. Analog VGA support with 300 MHz DAC Analog monitor support up to QXGA (2048 x 1536) Memory Dual channel non-ECC 1600/1333 MHz DDR3L memory up to 16GB in dual LVDS SODIMM socket Single/dual channel 18/24-bit LVDS from eDP (two lanes) Embedded BIOS Audio AMI EFI with CMOS backup in 8MB SPI BIOS with Intel AMT 9.0 support Chipset L3 Cache Intel HD Audio integrated in SOC 6MB for i7-4700EQ, 3MB for i5-4400E, i5-4402E, i3-4100E and i3-4102E Audio Codec Expansion Busses Located on carrier Express-BASE6 (ALC886 standard supported) PCI Express x16 (Gen3) or PCI Express (2 x8 or 1 x8 with 2 x4) 6 PCI Express x1 (AB): Lanes 0/1/2/3/4/5 Ethernet 1 PCI Express x1 (CD): Lane 6 Intel MAC/PHY: I217LM (Enterprise SKU) with AMT 9.0 support 2 LPC bus, SMBus (system) , I C (user) Interface: 10/100/1000 GbE connection SEMA Board Controller Supports: Voltage/Current monitoring, Power sequence debug support, AT/ ATX mode control, Logistics and Forensic information, Flat Panel Control, 2 General Purpose I C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control Debug Headers 40-pin multipurpose flat cable connector Use in combination with DB-40 debug module Providing BIOS POST code LED, BMC access, SPI BIOS flashing, Power Testpoints, Debug LEDs 60-pin XDP header for ICE debug of CPU/Chipset Note: build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these build option part numbers will need to be newly created and this will result in production lead times. Specifications I/O Interfaces Mechanical and Environmental USB: 4x USB 3.0 (USB 0,1,2,3) Form Factor: PICMG COM.0: Rev 2.1 Type 6 4x USB 2.0 (USB 4,5,6,7) Dimension: Basic size: 125 mm x 95 mm SATA: Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3) Operating Temperature Serial: 2 UART ports COM1/2 with console redirection Standard: 0C to +60C GPIO: 4 GPO and 4 GPI with interrupt Extreme Rugged: -40C to +85C (build option) Super I/O Humidity Supported on carrier if needed (standard support for W83627DHG-P) 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) TPM Shock and Vibration Chipset: Atmel AT97SC3204 IEC 60068-2-64 and IEC-60068-2-27 Type: TPM 1.2 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D Power Standard Input: ATX = 12V5% / 5Vsb 5% or AT = 12V 5% HALT tested Wide Input: ATX = 8.5~20 V / 5Vsb 5% or AT = 8.5~20V Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Management: ACPI 4.0 compliant, Smart Battery support Power States: C1-C6, S0, S1, S4, S3, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) ECO mode: Supports deep S5 mode for power saving Note: build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these build option part numbers will need to be newly created and this will result in production lead times.