Express-HLE COM Express Basic Size Type 6 Module with Intel Core and Celeron Processor with ECC Features Intel Core i7/i5/i3 Processor with Mobile Intel QM87 Express Chipset Up to 16GB Dual Channel ECC DDR3L at 1600MHz Three DDI ports support 3 independent displays Seven PCIe x1, one PCIe x16 GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0 Supports Smart Embedded Management Agent (SEMA ) functions Extreme Rugged operating temperature: -40C to +85C (build option) Specifications Core System Video CPU GPU Feature Support 4th Generation Intel Core i7 Processors (Mobile) - 22nm Generation 7.5 graphics core architecture, supporting i7-4700EQ 2.4 GHz (3.4 GHz Turbo), 47W (4C/GT2) 3 independent and simultaneous display combinations of DisplayPort /HDMI i5-4400E 2.7 GHz (3.3 GHz Turbo), 37W (2C/GT2) / LVDS monitors i5-4402E 1.6 GHz (2.7 GHz Turbo), 25W (2C/GT2) Encode/transcode HD content i3-4100E 2.4 GHz (no Turbo) 3MB, 37W (2C/GT2) i3-4102E 1.6 GHz (no Turbo) 3MB, 25W (2C/GT2) Digital Display Interface i7-4860EQ 2.4 GHz (3.2 GHz Turbo), 47W (4C/GT3) DDI1 supporting DisplayPort / HDMI / DVI Celeron 2000E 2.2 GHz (no Turbo) 35W (2C/GT1) DDI2 supporting DisplayPort / HDMI / DVI Celeron 2002E 1.5 GHz (no Turbo) 25W (2C/GT1) DDI3 supporting DisplayPort / HDMI / DVI Supports: Intel VT, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel VGA AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel TSX. Analog VGA support with 300 MHz DAC Note: Availability of the features may vary between processor SKUs. Analog monitor support up to QXGA (2048 x 1536) Memory LVDS Dual channel with ECC 1600/1333 MHz DDR3L memory up to 16GB in dual Single/dual channel 18/24-bit LVDS from eDP (two lanes) SODIMM socket Audio Embedded BIOS Chipset AMI EFI with CMOS backup in 8MB SPI BIOS with Intel AMT 9.0 support Intel HD Audio integrated in SOC L3 Cache 6MB for i7-4700EQ, 3MB for i5-4400E, i5-4402E, i3-4100E and i3-4102E Audio Codec Located on carrier Express-BASE6 (ALC886 standard supported) Expansion Busses PCI Express x16 (Gen3) or PCI Express (2 x8 or 1 x8 with 2 x4) Ethernet 6 PCI Express x1 (AB): lanes 0/1/2/3/4/5 Intel MAC/PHY: I217LM (Enterprise SKU) with AMT 9.0 support 1 PCI Express x1 (CD): lane 6 Interface: 10/100/1000 GbE connection 2 LPC bus, SMBus (system) , I C (user) I/O Interfaces SEMA Board Controller Supports: Voltage/Current monitoring, Power sequence debug support, AT/ USB: 4x USB 3.0 (USB 0,1,2,3) ATX mode control, Logistics and Forensic information, Flat Panel Control, 4x USB 2.0 (USB 4,5,6,7) 2 General Purpose I C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan SATA: Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3) Control Serial: 2 UART ports COM1/2 with console redirection Debug Headers GPIO: 4 GPO and 4 GPI with interrupt 40-pin multipurpose flat cable connector Use in combination with DB-40 debug module Providing BIOS POST code LED, BMC access, SPI BIOS flashing, Power Testpoints, Debug LEDs 60-pin XDP header for ICE debug of CPU/chipset Note: build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these build option part numbers will need to be newly created and this will result in production lead times. Specifications Super I/O Mechanical and Environmental Standard support for W83627DHG-P Form Factor: PICMG COM.0: Rev 2.1 Type 6 Supported on carrier if needed Dimension: Basic size: 125 mm x 95 mm Operating Temperature TPM Standard: 0C to +60C Chipset: Atmel AT97SC3204 Extreme Rugged: -40C to +85C (build option) Type: TPM 1.2 Humidity Power 5-90% RH operating, non-condensing Standard Input: ATX = 12V5% / 5Vsb 5% or AT = 12V 5% 5-95% RH storage (and operating with conformal coating) Wide Input: ATX = 8.5~20 V / 5Vsb 5% or AT = 8.5~20V Shock and Vibration Management: ACPI 4.0 compliant, Smart Battery support IEC 60068-2-64 and IEC-60068-2-27 Power States: C1-C6, S0, S1, S4, S3, S5 , S5 ECO mode (Wake on USB S3/S4, MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, WOL S3/S4/S5) Table 214-I, Condition D ECO mode: Supports deep S5 mode for power saving HALT Tested Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Operating Systems Standard Support Windows 7/8 32/64-bit, Linux 32/64-bit Extended Support (BSP) WES7/8, Linux , VxWorks, QNX Note: Build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that part numbers for SKUs with build options will need to be created and may cause production lead times.