X-On Electronics has gained recognition as a prominent supplier of LEC-BT4-4G-8G-ER Computer-On-Modules - COM across the USA, India, Europe, Australia, and various other global locations. LEC-BT4-4G-8G-ER Computer-On-Modules - COM are a product manufactured by ADLINK Technology. We provide cost-effective solutions for Computer-On-Modules - COM, ensuring timely deliveries around the world.

LEC-BT4-4G-8G-ER ADLINK Technology

LEC-BT4-4G-8G-ER electronic component of ADLINK Technology
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Part No.LEC-BT4-4G-8G-ER
Manufacturer: ADLINK Technology
Category: Computer-On-Modules - COM
Description: Computer-On-Modules - COM SMARC-Module INTEL E3845 BAY TRAIL 4G/8
Datasheet: LEC-BT4-4G-8G-ER Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 471.27 ea
Line Total: USD 471.27 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Thu. 14 Nov to Mon. 18 Nov
MOQ : 1
Multiples : 1
1 : USD 471.27
10 : USD 466.7275
25 : USD 455.5265
50 : USD 442.083

   
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RoHS - XON
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We are delighted to provide the LEC-BT4-4G-8G-ER from our Computer-On-Modules - COM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the LEC-BT4-4G-8G-ER and other electronic components in the Computer-On-Modules - COM category and beyond.

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LEC-BT SMARC Full Size Module with Intel Atom Processor E3800 Series System-on-Chip Features Single, dual or quad-core Intel Atom Processor E3800 Series System-on-Chip Up to 8 GB DDR3L at 1066/1333 MHz (ECC) HDMI and LVDS, onboard eMMC GbE, camera interface 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO Extreme Rugged operating temperatur e: -40C to 85C Specifications Core System I/O Interfaces PCIe CPU 3x PCIe x1 Gen2 Intel Atom E3800 Series, single, dual or quad-core SoC with integrated graphics Atom E3845 (4C/1333), 1.91 GHz, Gfx 542/792 MHz (Turbo), 10 W TDP USB 1x USB 3.0 + 3x USB 2.0 Atom E3826 (2C/1066), 1.46 GHz, Gfx 533/667 MHz (Turbo), 7 W TDP Atom E3815 (1C/1066), 1.46 GHz, Gfx 400/-MHz (No Turbo), 5 W TDP SATA 1x SATA 3 Gb/s Atom E3805 (2C/1066), 1.33 GHz (No GFX) 3W TDP SDIO 1x SDIO (4-bit) Memory Up to 8 GB DDR3L at 1066/1333 MHz, memory down with ECC Camera CSI 4L/1L Serial Embedded BIOS 2x SPI, 2x I2C, 1x I2S, Power Management, 2x UART AMI UEFI with CMOS backup in 8 MB SPI BIOS, Fast Boot support eMMC Soldered, bootable eMMC flash storage from 4 to 64 GB (optional) Cache GPIO 512 kB to 2 MB L2 cache 12x GPIO, 5x used for camera, 7x available SEMA Board Controller Video Supports: Voltage/Current monitoring, Power Sequencing, Logistics and Forensic GPU Feature Support Information, Flat Panel Control, IC Bus Control, GPIO Control, User Flash, Failsafe 7th generation Intel graphics core architecture with four execution units, supports two BIOS (dual BIOS), Watchdog Timer and Fan Control independent displays 2D and 3D graphics hardware acceleration Support for DirectX 11.1, OGLES 2.0, OGL 3.2 Video decode HW acceleration for H.264, MPEG2, VC1, VP8 formats Audio Video encode HW acceleration for H.264, MPEG2 formats Chipset Intel HD Audio integrated in SoC LVDS Single channel 18/24-bit LVDS from DDI0 Ports 1x IS and 1x HDA for audio codec on carrier HDMI/DP++ HDMI 1.4a from DDI1 Ethernet Intel MAC/PHY Power 1x Intel i210-IT Ethernet controller Standard Input 3.0 V~5.25 V DC 5% Interface 10/100/1000 GbE Power States C0-C6, S0, S3, S4, S5 P Mechanical and Environmental Intelligent Middleware SEMA Form Factor SMARC Specifications v1.1 Local management, control of embedded computer systems Extended EAPI for monitoring, controlling and analytics applications Multiple OS support and across platforms (x86, ARM) Dimension SMARC full size module, 82 mm x 80 mm Operating Temperature Standard: 0C to +60C Extreme Rugged: -40C to +85C Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Operation System Standard Support Linux, VxWorks, Windows 7/8, Windows Embedded, Compact 7 Extended Support (BSP) QNX, Android

Tariff Desc

8542.31.00 63 No Hybrid integrated circuits

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits, Digital:
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