X-On Electronics has gained recognition as a prominent supplier of LEC-iMX8MP-Q-4G-32G-ER Computer-On-Modules - COM across the USA, India, Europe, Australia, and various other global locations. LEC-iMX8MP-Q-4G-32G-ER Computer-On-Modules - COM are a product manufactured by ADLINK Technology. We provide cost-effective solutions for Computer-On-Modules - COM, ensuring timely deliveries around the world.

LEC-iMX8MP-Q-4G-32G-ER ADLINK Technology

LEC-iMX8MP-Q-4G-32G-ER electronic component of ADLINK Technology
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Part No.LEC-iMX8MP-Q-4G-32G-ER
Manufacturer: ADLINK Technology
Category: Computer-On-Modules - COM
Description: Computer-On-Modules - COM SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, 4 GB LPDDR4 , 32 GB eMMC, -40 C to 85 C
Datasheet: LEC-iMX8MP-Q-4G-32G-ER Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 280.984 ea
Line Total: USD 280.98 
Availability - 5
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
5
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 280.984
10 : USD 272.283
25 : USD 265.76
50 : USD 257.994
100 : USD 257.928
250 : USD 257.906
500 : USD 257.895
1000 : USD 257.884
2500 : USD 257.862

   
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LEC-IMX8MP SMARC 2.1 Short Size Module with NXP i.MX8M Plus Features NXP i.MX8M Plus with Quad Cortex-A53 Optional in-SoC 2.3 TOPS NPU SMARC revision 2.1 compliant LVDS, DSI, HDMI graphic output interfaces Dual CAN bus / USB 2.0 / USB 3.0 interfaces Dual GbE ports (one TSN capable) 2 I S audio codec interface Rugged operating temperature (optional): -40C to +85C 15 year product availability Specifications Core System Video SoC GPU Core NXP i.MX8M Plus with Quad core ARM Cortex-A53 Vivante GC7000UL TrustZone technology supports ARMv8 Cryptography Extensions GPU Feature Support GC7000UL (2 shaders), OpenGL ES 2.0/3.0/3.1, Vulkan, 2.3 TOPS Neural Processing Unit (optional) OpenCL 1.2 GC380 (2D) Memory VPU Feature Support 2/4/8GB LPDDR4L-4266 1080p60 VP9 Profile 0, 2 (10 bit) decoder (Hantro G2), L2 Cache input video stream can be 10-bit, the output decoded 512KB system L2 cache (ECC) video is always 8-bit after post-processing in G2 core 1080p60 HEVC/H.265 decoder (Hantro G2) Security 1080p60 AVC/H.264 Baseline, Main, High decoder (Hantro G1) Resource Domain Controller (RDC) supports 4 domains and up to 8 regions of DDR 1080p60 VP8 decoder (Hantro G1) Arm TrustZone (TZ) architecture: Cortex -A53 MPCore TrustZone support The video encoding features include: On-chip RAM (OCRAM) secure region protection using OCRAM controller 1080p60 AVC/H.264 Encoder High Assurance Boot (HAB) 1080p60 HEVC/H.265 Encoder Cryptographic Acceleration and Assurance Module (CAAM) HDMI Capable to support Widevine and PlayReady content protection HDMI 2.0a Public Key Cryptography (PKHA) with RSA and Elliptic Curve (ECC) algorithms Real-time integrity checker (RTIC) MIPI-DSI DRM support for RSA, AES, 3DES, DES 1x MIPI-DSI 4 lanes Side channel attack resistance Cameras True random number generation (RNG) MIPI-CSI RX Interface Manufacturing protection support / Secure Non-Volatile Storage (SNVS) - Compatible with the MIPI Alliance Interface specification v1.0 MIPI-DSI - Up to 4 data lanes, 1.0Gbps maximum data rate per lane 1x MIPI-DSI 4 lanes - Supports MIPI-HS, MIPI-LP mode Cameras 1x MIPI-CSI dual lane interface 1x MIPI-CSI quad lane interfaceLEC-IMX8MP Specifications System Storage Storage SDIO SDIO 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0 eMMC Power 16, 32, 64 or 128 GB (build option) Input Compatible with eMMC specifications 4.41, 4.51, 5.0 and 5.1 5Vdc +/- 5% SEMA Board Controller Mechanical and Environmental Voltage/current monitoring, boot configuration, logistics and Form Factor forensic information, flat panel control, watchdog timer SGET SMARC Specifications 2.1 Debug Header Dimensions 30-pin multipurpose flat cable connector for use with optional DB-30 debug SMARC short size module 82 mm x 50 mm module Operating Temperature Provides JTAG, BMC access UART, power test points diagnostic LEDs, Power, Reset, Boot configuration Standard: 0C to +60C Rugged: -40C to +85C (optional) Audio Humidity Audio Codec 5-90% RH operating, non-condensing 2 I S audio codec (located on carrier) 5-95% RH storage (and operating with conformal coating) Dual Ethernet Shock and Vibration Primary LAN IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, MAC 10/100/1000 Ethernet Controller on SoC (TSN capable) Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D Secondary LAN MAC 10/100/1000 Ethernet Controller on SoC HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Wireless Communication Operating Systems Wi-Fi IEEE 802.11 2X2 MIMO ac/a/b/g/n Wireless LAN Standard Support Yocto Linux BSP, Android Bluetooth Bluetooth 5.0 complaint with Bluetooth 2.1+Enhanced Data Rate (EDR) Extended Support (BSP) VxWorks Expansion Busses PCIe 2x PCIe x1 Gen3 USB CT 2x USB 3.0, 3x USB 2.0, 1x USB 2.0 OTG ER 1x USB 3.0, 1x USB 2.0/OTG UART Three UART interfaces SER1 and SER 2 (CTS/RTS) / SER0 (TX/RX/CTS/RTS) CAN 2x CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps SPI 2x SPI IS 2 2x I S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192KHz (see Audio Codec support) IC 2 Four I C interfaces - Support for 7-bit and 10-bit address mode - Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus GPIO 14x GPIO with interrupt, one GPIO with PWM

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Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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