nanoX-BT
Extreme Rugged COM Express Mini Size Type 10 Module with
Intel Atom E3800 series or Celeron Processor SoC
Features
Single, dual, quad-core Intel Atom or Celeron Processor SoC
Up to 4GB soldered Dual Channel DDR3L at 1333MHz
One DDI channel, one LVDS (build option, eDP)
Three PCIe x1
GbE, two SATA 3Gb/s, four USB and one USB client
Supports Smart Embedded Management Agent (SEMA ) functions
Extreme Rugged operating temperature: -40C to +85C
(build option)
Specifications
Core System
CPU
Debug Headers
Single, dual, quad-core Intel Atom or quad-core Celeron
40-pin multipurpose flat cable connector
Use in combination with DB-40 debug module
Atom E3845 1.91 GHz 542/792 Gfx (Turbo) 10W (4C/1333)
providing BIOS POST code LED, BMC access, SPI BIOS flashing, power test points,
Atom E3827 1.75 GHz 542/792 Gfx (Turbo) 8W (2C/1333)
debug LEDs
Atom E3826 1.46 GHz 533/667 Gfx (Turbo) 7W (2C/1066)
Atom E3825 1.33 GHz 533 Gfx (No Turbo) 6W (2C/1066)
60-pin XDP header for ICE debug of CPU/chipset on break out board
Atom E3815 1.46 GHz 400 Gfx (No Turbo) 5W (1C/1066)Atom E3805 1.33 GHz
(No GFX) 3W (2C/1066)
GPU Feature Support
Celeron N2930 1.83/2.16 (Burst) GHz, 313/854 (Turbo) 7.5W (4C/1333)
7th generation Intel graphics core architecture with four execution units
Celeron J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W (4C/1333)
supporting two independent displays
Supports: Single, dual or quad Out-of-Order Execution (OOE) processor cores,
3D graphics hardware acceleration
Intel VT-x, Intel SSE4.1 and SSE4.2, Intel 64 architecture, IA 32-bit ,
Supports for DirectX11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2
PCLMULQDQ Instruction DRNG, Intel Thermal Monitor (TM1 & TM2)
Note: Availability of features may vary between processor SKUs. Video decode hardware acceleration including support for H.264, MPEG2, MVC,
VC-1, WMV9 and VP8 formats
Memory
Video encode hardware acceleration including support for H.264, MPEG2 and
Single channel non-ECC 1333/1066 MHz soldered DDR3L memory up to 4GB
MVC formats
(2GB or 4GB)
Digital Display Interface
Embedded BIOS
One DDI channel supporting DisplayPort/HDMI/DVI
AMI EFI with CMOS backup in 8MB SPI BIOS
LVDS/eDP
Cache
Single channel 18/24-bit LVDS
Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way L1 write-back data (BOM option support for 24-bit EDID panel)
cache
eDP support (build option)
2MB for E3845, N2930 and J1900
1MB for E3827, E3826, E3825 and E3805
Audio
512K for E3815
Chipset
Expansion Busses
Intel HD Audio integrated in SOC
3 PCI Express x1 Gen2 (AB): Ianes 0/1/2;
Audio Codec
optional PCIe x4 (lose GbE)
Located on carrier miniBASE-10R
LPC bus, SMBus (system), I2C (user)
SEMA Board Controller
Ethernet
Supports: Voltage/Current monitoring, Power sequence debug support, AT/ATX
mode control, Logistics and Forensic information, Flat Panel Control, General
Intel MAC/PHY: Intel i210LM (MAC/PHY) Ethernet controller
Purpose I2C, Watchdog Timer
Interface: 10/100/1000 GbE connection
Note: Build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that part numbers for SKUs with build options will need to be created and may cause production lead times.Specifications
Mechanical and Environmental
I/O Interfaces
USB: 1x USB 3.0 (USB 0) 3x USB 2.0 (USB 1,2,3) and 1x USB 2.0 client (USB 7) Form Factor: PICMG COM.0: Rev 2.1 Type 10
Dimension: Mini size: 84 mm x 55 mm
SATA: Two SATA 3 Gb/s ports
Serial: 2 UART ports COM 0/1 (COM 0 support console redirection)
Operating Temperature
eMMC: Optional soldered on module bootable eMMC flash storage
Standard: 0C to +60C
8G to 32 GB
Extreme Rugged: -40 to +85C (build option, Atom E38xx series only)
SD: Optional, SD support multiplexed over GPIO pins
eMMC and SD functions may vary between OS Humidity
GPIO: 4 GPO and 4 GPI
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Super I/O
Shock and Vibration
On carrier if needed (standard support for W83627DHG-P)
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table
Power
214-I, Condition D
Standard Input: ATX = 12V5% / 5Vsb 5% or AT = 12V5%
HALT
Wide Input: ATX = 5-14V / 5Vsb (standard temp. only)
AT = 5-14V (standard temp. only) Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Management: ACPI 4.0 compliant, Smart Battery support
Power States: C0, C1, C1E, C4, C6
S0, S3, S4, S5 (Wake on USB S3/S4, WOL S3/S4/S5
ECO mode: Supports deep S5 (ECO mode) for power saving
Operating Systems
Standard Support
Windows 7/8 32/64-bit, Linux 32/64-bit
Extended Support (BSP)
WES7/8, Linux, VxWorks 32/64-bit, WEC7 32-bit
Note: Build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that part numbers for SKUs with build options will need to be created and may cause production lead times.