nanoX-AL COM Express Mini Size Type 10 Module with Intel Atom E3900 series SoC and Pentium /Celeron SoC Features Intel Atom E3900 series (formerly Apollo Lake) and Pentium /Celeron SoC, supporting full virtualization (VT-d/VT-x) Up to 8GB Dual Channel soldered non-ECC DDR3L at 1867/1600MHz Newest Intel Gen9 Low Power graphics, up to 4k resolution and H.265 codec Multiple PCIe x1 Gen2 (configurable to x2, x4), GbE Two SATA 6 Gb/s, two USB 3.0 and six USB 2.0, eMMC 5.0 (build option) Supports Smart Embedded Management Agent (SEMA) functions Extreme Rugged operating temperature: -40C to +85C (build option for E3900 series SKUs) Specifications Core System Video CPU GPU Feature Support Intel Atom E3900 series (formerly Apollo Lake) and Pentium /Celeron SoC Intel Generation 9 LP Graphics Core Architecture, supporting 2 independent and simultaneous display combinations of DisplayPort, HDMI, LVDS or eDP Intel Atom E3950 1.6/2.0GHz (Turbo), 12W (4C/1866) outputs Intel Atom E3940 1.6/1.8GHz (Turbo), 9W (4C/1866) Hardware encode/transcode (including HEVC) Intel Atom E3930 1.3/1.8GHz (Turbo), 6W (2C/1866) DirectX 12, DirectX 11.3, DirectX 10, DirectX 9.3 support Intel Pentium N4200 1.1/2.5GHz (Turbo), 6W (4C/1866) (by project basis) OpenGL 4.3 and ES 3.0 support Intel Celeron N3350 1.1/2.3GHz (Turbo), 6W (2C/1866) (by project basis) OpenCL 2.0 support Supports: Intel TXT, Intel SSE4.2, Intel 64 Architecture, IA 32-bit, Intel AES-NI, dual or quad Out-of-Order Execution (OOE) processor cores, Digital Display Interface PCLMULQDQ Instruction DRNG DDI0 supportts DisplayPort/HDMI/DVI Note: Availability of features may vary between processor SKUs. LVDS Memory Single channel 18/24-bit LVDS from eDP-to-LVDS IC Up to 8 GB Dual channel DDR3L at 1867/1600 MHz non-ECC 2GB is single channel eDP 4/8GB is dual channel 4 lane support (build option, in place of LVDS) Embedded BIOS Audio AMI EFI with CMOS backup in 16MB SPI BIOS (dual BIOS by build option) Chipset Cache Intel HD Audio integrated in SoC 2MB for all SKUs Audio Codec Expansion Busses On carrier miniBASE-10R Multiple PCI Express x1 Gen2: Lanes 0/1/2/3 (configurable to 3x1, 1x4, 1x2+2x1) Ethernet 2 LPC bus, SMBus (system) , I C (user) Intel Ethernet Controller I210 (Extreme Rugged operating temperature range) Intel Ethernet Controller I211 (standard operating temperature range) SEMA Board Controller Supports IEEE 1588 and GbE0 SDP (I210 only) Supports : Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS), watchdog timer and fan control Debug Headers 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs MIPI60 header for ICE debug of CPU/chipset on break out board (build option) Note: build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these build option part numbers will need to be newly created and this will result in production lead times. Specifications I/O Interfaces Mechanical and Environmental USB: 2x USB 1.1/2.0/3.0 (USB 0,1) and 6x USB 1.1/2.0 (USB 2,3,4,5,6,7) Form Factor: PICMG COM.0 Rev 2.1, Type 10 USB OTG support on USB 2.0 port 7 with Yocto Linux Dimension: Compact size: 84 mm x 55 mm SATA: Two ports SATA 6Gb/s (SATA0,1) Operating Temperature Serial: 2 UART ports Standard: 0C to 60C eMMC: eMMC 5.0 (8/16/32GB, build option) Extreme Rugged: -45C to +85C (build option with E39XX SoC SKUs) GPIO/SD: 4 GPO and 4 GPI SD signal is a build option supported by project basis Humidity Note: eMMC/SD boot device support depends on OS 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Super I/O Shock and Vibration Supported on carrier if needed (standard support for W83627DHG-P) IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table TPM (build option) 214-I, Condition D Chipset: Infineon Type: TPM 2.0 HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Power Operating Systems Standard Input: ATX: 12V5%, 5Vsb 5% AT: 12V5% Wide Input: ATX: 4.75-20 V, 5Vsb 5% AT: 4.75-20V (Standard Temp. only) Standard Support Management: ACPI 5.0 compliant, Smart Battery support Windows 10 64-bit, Yocto project based Linux 64-bit, VxWorks 64-bit Power States: C1-C6, S0, S3, S4, S5 and S5 ECO mode (Wake on USB S3/S4, WOL Extended Support (BSP) S3/S4/S5) VxWorks 64-bit ECO mode: Supports deep S5 mode for power saving Note: build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these build option part numbers will need to be newly created and this will result in production lead times.