X-On Electronics has gained recognition as a prominent supplier of THSF-CB-B Heat Sinks across the USA, India, Europe, Australia, and various other global locations. THSF-CB-B Heat Sinks are a product manufactured by ADLINK Technology. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

THSF-CB-B ADLINK Technology

THSF-CB-B electronic component of ADLINK Technology
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See Product Specifications
Part No.THSF-CB-B
Manufacturer: ADLINK Technology
Category: Heat Sinks
Description: Heat Sinks HIGH PERF HEATSINK FOR Express-CB/CBE
Datasheet: THSF-CB-B Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 91.8879
10 : USD 90.9978
25 : USD 88.825
50 : USD 86.2071
N/A

Obsolete
   
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RoHS - XON
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Mxhts
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We are delighted to provide the THSF-CB-B from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the THSF-CB-B and other electronic components in the Heat Sinks category and beyond.

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Type 2 COM Express Basic Size Type 2 Module with Intel Core i7/i5/i3 Processor Express-CB/CBE Features Intel Core i7/i5/i3 Processor with Mobile Intel QM57 Express Chipset Up to 8 GB Dual Channel DDR3 SDRAM at 1066 MHz (optional ECC) Six PCIe x1, one PCIe x16 for graphics (or general purpose x8/4/1) 18/24-bit LVDS and Embedded DisplayPort SATA 3 Gb/s IDE (PATA), Gigabit Ethernet, USB 2.0 Specifications Core System Audio CPU Intel Core i7-610E Processor (4M Cache, 2.53 GHz) 35 W Chipset Integrated in Intel PCH QM57 Intel Core i5-520E Processor (3M Cache, 2.40 GHz) 35 W Audio Codec On Express-BASE carrier (ALC886) Intel Core i7-620LE Processor (4M Cache, 2.00 GHz) 25 W Intel Core i7-620UE Processor (4M Cache, 1.06 GHz) 18 W Ethernet Intel Core i3-330E Processor (3M Cache, 2.13 GHz) 35W Intel Celeron Processor P4505 (2M Cache, 1.86 GHz) 35 W Chipset Integrated in Mobile QM57 with 82577LM PHY Intel Celeron Processor U3405 (2M Cache, 1.06GHz) 18W Interface 10/100/1000 Mbps Ethernet Memory Dual channel 800/1066 MHz DDR3 memory up to 8 GB in dual stacked SODIMM socket ECC memory for CBE series I/O Interfaces only Chipset Integrated on Intel PCH QM57 Chipset Mobile Intel QM57 Express Chipset USB Supports up to eight ports USB v. 2.0 L2 Cache 2 MB (Celeron M), 4/3 MB (Intel Core i7 / i5) SATA Four ports SATA 3 Gb/s with optional support for RAID BIOS AMI EFI with CMOS backup in 16 Mbit SPI flash 0,1,5,10 Hardware Monitor Supply voltages and CPU temperature PATA SATA to PATA bridge on SATA channel 1, Master only Watchdog Timer Programmable timer ranges to generate RESET Expansion Busses PCI Express x16 bus for discrete graphics solution or Super I/O general purpose PCI Express (2 x8 or 2 x4 or 2 x1) or Connected to LPC bus on carrier if needed Embedded Display Port (eDP) 7 PCI Express x1: Lanes 0/1/2/3/4/5 are free, lane 6 is occupied by GbE can be optionally configured as 1 PCIe x4 TPM (optional) (on 0/1/2/3) and 2 PCIe x1 (4/5) Chipset Infineon SLB9635TT1.2 32-bit PCI: PCI Rev. 2.3 at 33MHz, supporting 4 bus masters Type TPM 1.2 2 LPC bus, SMBus (system) , I C (user) Power Video Input Power AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) Integrated in Gen 5.75 with 12 execution units Power States Supports S0, S1, S3, S4, S5 Processor Power Consumption 21 W with Core i7-620UE at 1.2 GHz and 2 GB memory Integrated Video DirectX 10 and OpenGL 2.1 typical Feature Support Intel Dynamic Video Memory Technology (Intel DVMT 5.0) Smart Battery Support Yes Video capture via x1 concurrent PCI Express port PAVP (Protected Audio-Video Path) support for Protected Mechanical and Environmental Intel HD Audio Playback Dimension Basic size: 125 mm x 95 mm High performance MPEG-2 decoding Operating Temperature Standard: 0C to +60C WMV9 (VC-1) and H.264 (AVC) support Storage Temperature -20C to +80C Hardware acceleration for MPEG2 VLD/iDCT Humidity 90% at +60C Microsoft DirectX 10 support Shock 15G peak-to-peak, 11ms duration, non-operation OpenGL 2.1 support Vibration Non-operating: 1.88 Grms, 5-500 Hz, each axis Blu-ray support 40 Mb/s Operating: 0.5 Grms, 5-500 Hz, each axis Hardware motion compensation Compatibility COM Express Type 2, Basic form factor 125 mm x 95 mm Intermediate Z in classic rendering Certification CE, FCC VGA Analog VGA support by 300 MHz DAC Analog monitor support up to QXGA ( 2048 X 1536) Operating Systems LVDS Single / Dual channel 18/24-bit panels Standard Support Windows XP(e), Vista, Windows 7, Linux Extended Support (BSP) Embedded XP support package, Linux 2.6.x BSP, VxWorks 6.x BSP, AIDI Library for Windows and Linux Functional Diagram DDR3 SODIMM Channel A with or without ECC DDR3 CPU Memory 800/1066 MHz Controller Intel Core with DDR3 SODIMM ECC Channel B i7 / i5 / i3 with or without ECC 800/1066 MHz PCIe x16 Gfx 2 PCIe x8 Embedded DisplayPort (eDP) Embedded Graphics Core VGA LVDS DMI FDI Audio VGA SDVO LVDS HDMI (3x) dual 18/24-bit DVI (3x) DisplayPort (3x) HD Audio Intel GbE LAN PHY LAN (occupies PCIe x1 port 6) MAC 82577LM PCH PCIe x1 Mobile Intel QM57 PCIe x1 (port 0/1/2/3/4/5) Express Chipset JM330 PATA IDE SATA (1 port) SATA to PATA PCI SATA (4 ports) 6x 33 MHz PCI SATA 2 8x v2.3 USB 2.0 SPI LPC USB Test Header SMBus BIOS MAX6621 LM87 2 GPIO I C to GPIO Mon(T) Mon(T/V) TPM 2 I C BC LPC Ordering Information Accessories Modules Non-ECC ECC Description/Configuration Model Number Description/Configuration Model Number Model Number Heat Spreaders Express-CB-i3-330E Express-CBE-i3-330E COM Express Basic Size Type 2 HTS-CB-B Heatspreader with threaded standoffs for Express-CB/CBE Module with Intel Core i3-330E HTS-CB-BT Heatspreader with thouth hole for top mounting for SV at 2.13 GHz Express-CB/CBE Express-CB-i5-520E Express-CBE-i5-520E COM Express Basic Size Type 2 Active Heatsink Module with Intel Core i5-520 THSF-CB-B Heatsink with fan and threaded standoffs for Express-CB/ SV at 2.4 GHz CBE Express-CB-i7-610E Express-CBE-i7-610E COM Express Basic Size Type 2 Module with Intel Core i7-610E SV at 2.53 GHz Express-CB-i7-620LE Express-CBE-i7-620LE COM Express Basic Size Type 2 Module with Intel Core i7-620LE LV at 2.0 GHz Express-CB-i7-620UE Express-CBE-i7-620UE COM Express Basic Size Type 2 Module with Intel Core i7-620UE ULV at 1.07 GHz Express-CB-U3405 Express-CBE-U3405 COM Express Basic Size Type 2 Module with Intel Celeron U3405 ULV at 1.06 GHz Express-CB-P4505 Express-CBE-P4505 COM Express Basic Size Type 2 Module with Intel Celeron P4505 SV at 1.86 GHz Note: All specifications are subject to change without further notice. AB SMBus GPIO CD

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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