THSF-cSL-B ADLINK Technology

cExpress-SL COM Express Compact Size Type 6 Module with 6th Gen Intel Core and Celeron Processors Features 6th Generation Intel Core and Celeron Processors Up to 32GB Dual Channel non-ECC DDR4 at 1867/2133MHz Two DDI channels, one LVDS (build option 4 lanes eDP), supports up to 3 independent displays GbE, up to 6 PCIe x1 (build option) Up to three SATA 6 Gb/s, four USB 3.0 and four USB 2.0 Supports Smart Embedded Management Agent (SEMA ) functions Extreme Rugged operating temperature: -40C to +85C (build option) Specifications Core System Video CPU GPU Feature Support Intel Generation 9 LP Graphics Core Architecture, supporting 3 independent 6th Generation Intel Core and Celeron Processors - Mobile 14nm process and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP (formerly Skylake-U) outputs Core i7-6600U 2.6/3.4GHz (Turbo), 4M, 15W (7.5W cTDP)(2C/GT2) Hardware encode/transcode HD content (including HEVC DirectX 12, DirectX Core i5-6300U 2.4/3.0GHz (Turbo), 3M, 15W (7.5W cTDP) (2C/GT2) 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support Core i3-6100U 2.3GHz, 3M, 15W (7.5W cTDP) (2C/GT2) Celeron 3955U 2GHz, 2M, 15W (10W cTDP) (2C/GT1) OpenGL 5.0, 4.4/4.3 and ES 2.0 support Supports: Intel VT, Intel TXT, Intel SSE4.2, Intel HT Technology, Intel 64 OpenCL 2.1, 2.0/1.2 support Architecture, Execute Disable Bit, Intel Turbo Boost Technology 2.0, Intel AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel Digital Display Interface TSX. DDI1/2 supporting DisplayPort/HDMI/DVI Note: Availability of features may vary between processor SKUs. LVDS Memory Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC Dual channel 1867/2133 MHz non-ECC DDR4 memory up to 32GB in dual SODIMM socket eDP 4 lane support build option, in place of LVDS Embedded BIOS AMI EFI with CMOS backup in 8MB SPI BIOS with Intel AMT 11.0 support Audio (AMT support available on Core i7/i5 only) Chipset Cache Intel HD Audio integrated in SOC 4MB for Core i7, 3MB for Core i5 and Core i3, 2MB for Celeron Audio Codec Expansion Busses On carrier Express-BASE6 (ALC886 standard support) Up to 6 PCI Express x1 (AB): Lanes 0-5 (configurable to x2, x4, Lane 5 by build option) Ethernet 2 Note: Gen3 for Core i7/i5/i3, Gen2 for Celeron LPC bus, SMBus (system) , I C (user) Intel MAC/PHY: i219LM/V with AMT 11.0 support SEMA Board Controller Interface: 10/100/1000 GbE connection Supports : Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, I/O Interfaces 2 general purpose I C, failsafe BIOS (dual BIOS ), watchdog timer and fan USB: 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0 (USB 4,5,6,7) control SATA: Up to three ports SATA 6 Gb/s (SATA 0,1,2 Celeron supports two ports Debug Headers only 40-pin multipurpose flat cable connector for use with DB-40 debug module Serial: 2 UART ports with console redirection providing BIOS POST code LED, BMC access, SPI BIOS flashing, power GPIO: 4 GPO and 4 GPI from BMC testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset Note: build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these build option part numbers will need to be newly created and this will result in production lead times. NewSpecifications Super I/O Mechanical and Environmental Supported on carrier if needed (standard support for W83627DHG-P) Form Factor: PICMG COM.0: Rev 2.1 Type 6 Dimension: Compact size: 95 mm x 95 mm TPM Operating Temperature Chipset: Atmel AT97SC3204 Standard: 0C to 60C Type: TPM 1.2 Extreme Rugged: -40C to +85C (build option) Power Humidity Standard Input: ATX = 12V5% / 5Vsb 5% or AT = 12V5% 5-90% RH operating, non-condensing Wide Input: ATX = 5-20V / 5Vsb 5% or AT = 5-20V 5-95% RH storage (and operating with conformal coating) Management: ACPI 5.0 compliant, Smart Battery support Shock and Vibration Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, IEC 60068-2-64 and IEC-60068-2-27 WOL S3/S4/S5) MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, ECO mode: support deep S5 mode for power saving Table 214-I, Condition D Operating Systems HALT Standard Support Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Windows 7 32/64-bit, Windows 10/8.1 64-bit, Linux 64-bit Extended Support (BSP) WES7 32/64-bit, Linux 64-bit Note: Build option indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that part numbers for SKUs with build options will need to be created and may cause production lead times.