X-On Electronics has gained recognition as a prominent supplier of ATS-51425K-C1-R0 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. ATS-51425K-C1-R0 Heat Sinks are a product manufactured by Advanced Thermal Solutions. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

ATS-51425K-C1-R0 Advanced Thermal Solutions

ATS-51425K-C1-R0 electronic component of Advanced Thermal Solutions
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Part No.ATS-51425K-C1-R0
Manufacturer: Advanced Thermal Solutions
Category: Heat Sinks
Description: Heat Sinks maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, T412, 42.5x42.5x14.5mm, 72.8mm Fin Tip
Datasheet: ATS-51425K-C1-R0 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 18.7131 ea
Line Total: USD 18.71 
Availability - 24
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ: 1  Multiples: 1
Pack Size: 1

 ATS-51425K-C1-R0 More Buying Options & Price Grid(s)

Availability Price Quantity
24
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 18.7131
3 : USD 17.6841
25 : USD 17.3901

Specifications

   
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We are delighted to provide the ATS-51425K-C1-R0 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ATS-51425K-C1-R0 and other electronic components in the Heat Sinks category and beyond.

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Additional Infomation About Product

The ATS-51425K-C1-R0 is a complete heat sink solution for BGA packages that are up to 42.5x42.5x14.5mm in size. It features a maxiFLOW baseplate that is designed for maximum heat transfer, as well as a low-profile maxiGRIP attachment system for easy installation. The heat sink also has a T412 thermal pad for improved heat dissipation and retention, with 72.8 mm fin tips for increased airflow and increased cooling. The C1-R0 specification indicates that the attached thermal pad is of type D, which refers to high-temp silicone grease, with a rated melt temperature between +105°C and +127°C. The high-grade aluminum construction of the ATS-51425K-C1-R0 also helps ensure durability in demanding environments.

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

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