The ATS-PCB1006 with Heat Sinks BGA Heat Sink, Board Level Stamp, No TIM, Black, TO220, 19.1x21.84x9.91mm LxWxH is a high-performance heat sink made by Advanced Thermal Solutions. It is designed to quickly and efficiently dissipate heat for all types of popular BGA integrated circuits and chips. This heat sink uses advanced stamp-forming technology to increase heat dissipation ability and to reduce weight, making it ideally suited for board-level applications. It is RoHS compliant and contains no thermal interface material (TIM) enhancing the product's durability and efficiency. It is designed with a black finish, comes in a TO220 package, and measures 19.1x21.84x9.91mm (LxWxH).