X-On Electronics has gained recognition as a prominent supplier of ATS-PCB1025 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. ATS-PCB1025 Heat Sinks are a product manufactured by Advanced Thermal Solutions. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

ATS-PCB1025 Advanced Thermal Solutions

ATS-PCB1025 electronic component of Advanced Thermal Solutions
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Part No.ATS-PCB1025
Manufacturer: Advanced Thermal Solutions
Category: Heat Sinks
Description: Heat Sinks BGA Heat Sink, Board Level Stamp, No TIM, Black, TO220, 14.22x15.75x9.4mm LxWxH
Datasheet:
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.1466 ea
Line Total: USD 1.15 
Availability - 358
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
358
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 1.1466
10 : USD 1.0496
20 : USD 0.8908
55 : USD 0.8423
1000 : USD 0.8276

   
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We are delighted to provide the ATS-PCB1025 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ATS-PCB1025 and other electronic components in the Heat Sinks category and beyond.

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, Inc.The ATS-PCB1025 with Heat Sinks BGA Heat Sink, Board Level Stamp, No TIM, Black, TO220, 14.22x15.75x9.4mm LxWxH is an advanced thermal solution designed for optimal performance, maximum heat dissipation, and superior reliability. It is a black TO220 form factor package measuring 14.22mm wide, 15.75mm long, and 9.4mm tall with no thermal interface material (TIM). The heat sink utilizes a board level stamped construction to ensure stability and durability, and is also designed for maximum system compatibility with minimal effort on the part of the user. The ATS-PCB1025 provides a robust heat sink solution, allowing for increased performance and reliability without sacrificing on cost.

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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