, Inc.The ATS-PCB1025 with Heat Sinks BGA Heat Sink, Board Level Stamp, No TIM, Black, TO220, 14.22x15.75x9.4mm LxWxH is an advanced thermal solution designed for optimal performance, maximum heat dissipation, and superior reliability. It is a black TO220 form factor package measuring 14.22mm wide, 15.75mm long, and 9.4mm tall with no thermal interface material (TIM). The heat sink utilizes a board level stamped construction to ensure stability and durability, and is also designed for maximum system compatibility with minimal effort on the part of the user. The ATS-PCB1025 provides a robust heat sink solution, allowing for increased performance and reliability without sacrificing on cost.