, Inc.The ATS-PCB1048 with Heat Sinks BGA Heat Sink, Board Level Stamp, No TIM, Black, TO220, 34.04x20.32x20.32mm is an advanced electronic component manufactured by Advanced Thermal Solutions, Inc. This part works as a thermal management solution for use on circuit boards. It helps to dissipate the heat generated by high-performance processors and other components. It has an optimized thermal design with embedded bead or stamp technology and features no TIM (thermal interface material) for easier and faster system assembly. The heat sink has a black TO220 package and measures 34.04x20.32x20.32 mm. It offers an efficient way to spread heat across a large board area, and provides excellent thermal protection and improved system performance.