X-On Electronics has gained recognition as a prominent supplier of ATS-PCB1057 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. ATS-PCB1057 Heat Sinks are a product manufactured by Advanced Thermal Solutions. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

ATS-PCB1057 Advanced Thermal Solutions

ATS-PCB1057 electronic component of Advanced Thermal Solutions
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Part No.ATS-PCB1057
Manufacturer: Advanced Thermal Solutions
Category: Heat Sinks
Description: Heat Sinks BGA Heat Sink, Board Level Stamp, No TIM, Tin Plate, TO220, 41.2x51x19mm (LxWxH)
Datasheet:
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 3.7632 ea
Line Total: USD 3.76 
Availability - 180
Ship by Tue. 24 Dec to Thu. 26 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
180
Ship by Tue. 24 Dec to Thu. 26 Dec
MOQ : 1
Multiples : 1
1 : USD 3.7632
6 : USD 3.1605
16 : USD 2.9841
200 : USD 2.9547

   
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Heatsink Material
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We are delighted to provide the ATS-PCB1057 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ATS-PCB1057 and other electronic components in the Heat Sinks category and beyond.

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The ATS-PCB1057 is a Board Level Stamp, BGA Heat Sink designed by Advanced Thermal Solutions with no TIM and a 41.2x51x19mm (LxWxH) size body. It is made of tin-plated Aluminum alloy, with pre-defined and pre-drilled mounting hole patterns that are suitable for various integrated circuits. It has a compact and light design to fit in with various types of PCB environments. It is designed for large vertical mounting applications where a footprint is limited. It can handle both TO220 and TO247 packages. The advanced design ensures maximum heat dissipation with minimized airflow resistance. This design makes the ATS-PCB1057 an ideal choice for applications where the utmost thermal performance and space saving is a top priority.

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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