ATS-UC-DFLOW-100 Advanced Thermal Solutions

dualFLOW /quadFLOW CPU Coolers for Servers Description: Designed for cooling dense 1U or 2U applications using CPUs fit the Intel LGA2011 square and LGA2066 sockets (Socket R) Heat Sink Type: Heat Sink with Blower Heat Sink Attachment: Hardware Kit - ATS-HK152-R0 *Image is for illustration purposes only. Features & Benefits Ideal for 1U and 2U applications where space and airflow are restricted Designed for CPUs that fit the Intel LGA201 1 square and LGA2066 sockets (Socket R) Mechanical attachment is PEM, screws and spring for other types of attachments contact ATS Provided with Chomerics T670 thermal grease dualFLOW airflow direction Hardware provides 9.2 PSI (63 kPa) when installed PWM enabled blower: 10.8 VDC ~ 13.2 VDC operating voltage Provides at least 20% improvement over comparable products on the market To apply this heat sink to other high power devices and processors contact ATS Patent Pending quadFLOW airflow direction Product Details Fin R Max DIM DIM DIM Weight P/N DIM A DIM B Mate- Finish (C/W) TDP Application Notes C D E (g) (2)(3) rial (W) ATS-UC- Nickel For PCB layouts with restricted airflow, aluminum fins reduce 92.38 92.11 29 80 80 Al 456 0.21 152 QFLOW-100 Plated weight and air enters the heat sink from four directions Nickel For less-restricted PCB layouts, aluminum fins reduce weight and ATS-UC- 92.38 92.11 29 80 80 Al 436 0.20 160 DFLOW-100 Plated air enters the heat sink from two directions ATS-UC- Nickel For dense PCB layouts, copper fins improve heat spreading and 92.38 92.11 29 80 80 Cu 580 0.20 160 QFLOW-200 Plated air enters heat sink from four directions ATS-UC- Nickel For less-dense PCB layouts, copper fins improve heat spreading 92.38 92.11 29 80 80 Cu 566 0.19 170 DFLOW-200 Plated and air enters heat sink from two directions ATS-UC- For dense PCB layouts, vapor chamber base maximizes heat spread- Nickel 92.38 92.11 29 80 80 Cu 493 0.20 160 QFLOW-VC-200 Plated ing from small heat sources and air enters from four directions ATS-UC- For less-dense PCB layouts, vapor chamber base maximizes heat Nickel 92.38 92.11 29 80 80 Cu 479 0.20 160 Plated DFLOW-VC-200 spreading from small heat sources and air enters from two directions BLOWER NOTES: CONNECTOR 1. Thermal performance data are provided for reference only. Actual performance C may vary by application. 2. Thermal resistance data are for 40 x 40mm component. 3. Thermal resistance is based on 100% duty cycle of the blower 4. The fan connector can be mated to a system in the following ways: via a computer motherboards included 4-pin header, to a standard 4-pin fan header such as the Molex 0470531000 or a standard 3-pin fan header. If a 3-pin header is used, the speed control option cannot be accessed. 5. Lead wires: Pin 1-Black (-), Pin 2-Red (+12V), Pin 3-Yellow (Tach), Pin 4-Blue (PWM) 6. Max TDP (thermal design power) maximum amount of heat generated by component B A 7. ATS reserves the right to update or change its products without notice to improve the EE design or performance 8. RoHS-6 and REACH compliant DD For further technical information, please contact Advanced Thermal Solutions, Inc. R5 0219 89-27 ACCESS ROAD, NORWOOD, MA 02062 USA T: 781.769. 2800 WWW.QATS.COM ATS-HQ QATS.COMX-ON Electronics Largest Supplier of Electrical and Electronic Components Click to view similar products for Heat Sinks category: Click to view products by Advanced Thermal Solutions manufacturer: Other Similar products are found below : 581102B00000G 656-15ABPE 657-20ABPNE 7020B-TC12-MTG 73452PPBA 7G0011A PF720G A22-4026 120-1873-007 HAH10L HAH15L 1542616-1 HS-2506-F1 HS-87M0-F2 218-40CTE3 231-69PAB-15V 25-7520 SW50-4G 231-75PAB-13V 231-75PAB-15V 253- 122ABE-22 PSC22CB HAF10L HAQ10T D10100-28 BDN183CBA01 3-21053-4 32438 TX0506-1B TX1806B LAE66A3CB WA-DT2- 101E 511-3U 73381PPBA 73403PPBA 7G0047C COMX-440-HSP 510-12M D10650-40T5 V8511 Y APF40-40-13CB/A01 780653U04500G ATS-54310K-C2-R0 FK 216 CB SA FK 231 SA 220 648-51AB 657-20ABPESC 2341BG 679-25AG FK 212 CB SA