X-On Electronics has gained recognition as a prominent supplier of ATS-X53250G-C1-R0 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. ATS-X53250G-C1-R0 Heat Sinks are a product manufactured by Advanced Thermal Solutions. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

ATS-X53250G-C1-R0 Advanced Thermal Solutions

ATS-X53250G-C1-R0 electronic component of Advanced Thermal Solutions
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Part No.ATS-X53250G-C1-R0
Manufacturer: Advanced Thermal Solutions
Category: Heat Sinks
Description: Heat Sinks BGA Cooling Solutions with superGRIP Attachment, High Performance, 25x25x12.5mm
Datasheet: ATS-X53250G-C1-R0 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 23.4759 ea
Line Total: USD 23.48 
Availability - 24
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
24
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 23.4759
3 : USD 22.197
25 : USD 21.9765

   
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Thermal Resistance @200 Lfm
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We are delighted to provide the ATS-X53250G-C1-R0 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ATS-X53250G-C1-R0 and other electronic components in the Heat Sinks category and beyond.

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, Inc.The ATS-X53250G-C1-R0 is a heat sink BGA cooling solution from Advanced Thermal Solutions, Inc. It is made from high-quality aluminum and features a unique superGRIP attachment system for secure mounting, making it ideal for ball grid array (BGA) components. The heat sink measures 25x25x12.5mm and is designed to efficiently dissipate the heat generated by these components, ensuring a reliable and safe operating temperature. The high performance products offered by Advanced Thermal Solutions come with a UL certification and are compatible with a variety of BGA chipsets.

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
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