WS483 Sn62 and Sn63 Water Soluble Solder Paste Features: - 48 Hour Stencil Life - Excellent Printing Characteristics - Extended Cleaning Window - Excellent Activity - Slump Resistant - High-Humidity Resistant - 24 Hour Tack Time - Good for Batch or Continuous Runs - Will Not Foam During Wash Description: WS483 is an organically activated formulation developed to better resist the effects of increased humidity levels. WS483 offers improved heat and humidity resistance, while maintaining high tack and resistance to slump. WS483 also provides an exceptional post-process cleaning window and will not foam during the cleaning process, even in high-pressure wash systems. Printing: - Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16 mm ( to inch) is normally sufficient to begin). - Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and workable properties. - WS483 provides the necessary tack time and force for todays high speed placement equipment, which will enhance product performance and reliability. RECOMMENDED INITIAL PRINTER SETTINGS BELOW ARE DEPENDENT ON PCB AND PAD DESIGN PARAMETER RECOMMENDED INITIAL SETTINGS PARAMETER RECOMMENDED INITIAL SETTINGS Squeegee Pressure 0.10-0.30 kg/cm (.6 - 1.7 lbs/In.) of blade PCB Separation Distance 0.75-2.0 mm (.030-.080) Squeegee Speed 12-150 mm/sec (.5-6/sec) PCB Separation Speed Slow Snap-off Distance On Contact 0.00 mm (0.00) Reflow Profile: A straight ramp-spike profile should be used as shown below. The shaded area defines the process window. Oven efficiency, board size/mass, component type and density all influence the final profile for a given assembly. This profile is a starting point, and processing boards with thermal-couples attached is recommended to optimize the process. RATE OF RISE TO PEAK TEMP TIME ABOVE COOLDOWN PROFILE LENGTH 1.0-1.3 C / SEC MAX 210 C-220C 183 C (380F) 4C / SEC AMBIENT TO COOL DOWN (410F-430F) Standard Profile 45-75 Sec 30-60 Sec 45 15 Sec 2.75-3.5 Min THE RECOMMENDED REFLOW PROFILE FOR WS483 IS PROVIDED AS A GUIDELINE. OPTIMAL PROFILE MAY DIFFER DUE TO OVEN TYPE, ASSEMBLY , OR OTHER PROCESS VARIABLES. CONTACT AIM TECHNICAL SUPPORT IF YOU REQUIRE ADDITIONAL PROFILING ASSISTANCE. LAYOUT THE REFLOW PROFILE FOR THE Sn/Pb PASTES USING A VAPOR PHASE REFLOW OVEN: PEAK TEMPERATURE RANGE I S 230C 245C. Compatible Products: - Electropure Solder Bar - WS Tacky Flux - WS715 WS375 Spray Flux - WS482 Cored Wire - Epoxy 4089 Chip Bonding Epoxy Cleaning: WS483 can be cleaned easily with normal tap water. Deionized water is recommended for the final rinse. A temperature of 38C (100F) - 66C (150F) is sufficient for removing residues. An in-line or other pressurized spray cleaning system is suggested, but is not required. Handling and Storage: - WS483 has a refrigerated shelf life of 6 months at 4C (40F) - 12C (55F). - Allow the solder paste to warm naturally to ambient temperature (8 hrs.) prior to breaking the seal for use. - Mix the product lightly and thoroughly for 1 to 2 minutes to ensure even distribution of any separated material. - Do not store new and used paste in the same container, and reseal any opened containers while not in use. - Replace the internal plug and cap of the 500 gram jars to ensure the best possible seal. Safety: - Use with adequate ventilation and proper personal protective equipment. - Refer to the accompanying Material Safety Data Sheet for any specific emergency information. - Do not dispose of any lead-containing materials in non-approved containers. Physical Properties: ITEM SPECIFICATION Appearance Gray, Smooth, Creamy Alloy Sn63 and Sn62 Melting Point 183C Particle Size T3, T4, T5 General Metal Loading 90% (T3) Viscosity Print/Dispense Packaging Available in all industry standard packaging.