22460 AIM

NC258 NO CLEAN SOLDER PASTE FEATURES Long Pause-to-Print Capabilities Excellent Wetting, Even Leadless Devices Reduces Voiding Low Post Process Residues RoHS Compliant Passes Bono Testing DESCRIPTION NC258 has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 reduces voiding. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. It also offers very low post process residues, which remain crystal clear even at the elevated temperatures required for todays lead-free alloys. CHARACTERISTICS HANDLING & STORAGE Parameter Time Temperature Refrigerated Shelf 1 year 0C-12C (32F-55F) Low Life Halogen Unrefrigerated 3 months < 25C (< 77F) Content Shelf Life Pause to Do not add used paste to unused paste. Store used paste Print Print Volume separately keep unused paste tightly sealed with internal plug Capabilities or end cap in place. See AIMs paste handling guidelines for further information. Alloy and storage conditions may affect shelf life. Please refer to NC258 Certificate of Analysis for Low Voiding Reliability product specific information. on BGAs CLEANING Pre-Reflow: AIM DJAW-10 effectively removes NC258 solder paste from stencils while in process. DJAW-10 can be Residue Low Voiding Appearance on BTCs hand applied or used in under stencil wipe equipment. DJAW- 10 will not dry NC258 and will enhance transfer properties. Do not over-apply DJAW-10. Do not apply DJAW-10 to Pin Mitigates stencil topside. Isopropanol (IPA) is not recommended in Probability HiP process, but may be used as a final stencil rinse. Post-Reflow Flux Residue: NC258 residues can remain on the assembly after reflow and do not require cleaning. Where cleaning is mandated, AIM has worked closely with industry NC258 NC520 M8 partners to ensure that NC258 residues can be effectively removed with common defluxing agents. Contact AIM for cleaning compatibility information. Document Rev NF9 Page 1 of 4 REFLOW PROFILE Detailed profile information may be found at