89268 AIM

M8 NO CLEAN SOLDER PASTE FEATURES Low Voiding: <5% on BGA and <10% on BTC Excellent Print Transfer Efficiencies <0.50 AR Eliminates HiP Defects REACH and RoHS* Compliant Halogen-Free Formulated for use with T4 and Finer Powders Powerful Wetting on Lead-Free Surface Finishes Minimal Transparent Residue LED Compliant Passes Bono and Automotive SIR Testing DESCRIPTION M8 no clean solder paste brings performance to the next level. Developed in combination with T4 and finer mesh leaded and lead- free alloy powders, M8 provides stable transfer efficiencies required for todays UFP and umBGA devices, reducing DPMO on the most challenging applications. M8 activators will reduce wetting related defects such as HiP (head-in-pillow) and provide smooth shiny HANDLING & STORAGE joints. M8 has reduced BGA and BTC voiding to as low as <5% on Parameter Time Temperature BGA and <10% on BTC ground pads. M8 passes stringent Sealed Refrigerated 1 year 0C-12C (32F-55F) automotive and high reliability SIR and electrochemical test Shelf Life requirements. Sealed Unrefrigerated 3 months < 25C (< 77F) Shelf Life CHARACTERISTICS Do not add used paste to unused paste. Store used paste separately keep unused paste tightly sealed with internal plug Low Halogen or end cap in place. After opening, solder paste shelf life is Content environment and application dependent. See AIMs paste Pause to Print handling guidelines for further information. Alloy and storage Print Volume Capabilities conditions may affect shelf life. Please refer to M8 Certificate of Analysis for product specific information. Low Voiding Reliability CLEANING on BGAs Pre-Reflow: AIM DJAW-10 effectively removes M8 solder paste from stencils while in process. DJAW-10 can be hand applied or used in under stencil wipe equipment. DJAW-10 Residue Low Voiding will not dry M8 and will enhance transfer properties. Do not Appearance on BTCs over-apply DJAW-10. Do not apply DJAW-10 to stencil topside. Isopropanol (IPA) is not recommended in process, but Pin Probability Mitigates HiP may be used as a final stencil rinse. Post-Reflow Flux Residue: M8 residues can remain on the NC258 NC520 M8 assembly after reflow and do not require cleaning. Where *Lead-free alloys. cleaning is mandated, AIM has worked closely with industry partners to ensure that M8 residues can be effectively removed with common defluxing agents. Contact AIM for cleaning compatibility information. Document Rev NF22 Page 1 of 3 REFLOW PROFILE Detailed profile information may be found at