MPP, MQP Series Z-Foil Ultra High-Precision SMT Resistor (Molded, J-Lead Terminal) FEATURES Temperature coefficient of resistance (TCR): 0.05 ppm/C typical (0C to +60C) by New Generation Z-Foil Technology 0.2 ppm/C typical (55C to +125C, +25C ref.) Resistance tolerance: to 0.01% Power coefficient R due to self heating: 5 ppm at rated power (typical) MQP Power rating: to 200 mW (MPP) and 250 mW (MQP) at +70C Load life stability: to 0.005% at 70C, 2000h at rated power (typical) MPP Not restricted to standard values, we can supply specific as required values at no extra cost or delivery (e.g., 1K2345 vs. 1K) COMPOSITION OF TYPE NUMBER TCR, RESISTANCE RANGE, TOLERANCE, Example: RATED POWER TCR Rated MPP 10K005* T L Resistance (ppm/C) Resistance Power Type Range Tape & Reel Package Required 55C to Tolerance (%) (W) at () Resistance Tolerance +125C 125C Resistance Value 0.23.8 30 to <50 0.1(B) Type 0.22.8 50 to <100 0.1(B) MPP 0.1 Resistance value, in ohm, is expressed by a series of six 100 to <1k 0.02(Q) 0.05(A) 0.1(B) characters, five of which represent significant digits. R or K is a 0.21.8 0.01(T) 0.02(Q) 0.05(A) 1k to 20k dual-purpose letter that designates both the value range (R for 0.1(B) ohmic K for kilo-ohm) and the location of the decimal point. 0.23.8 30 to <50 0.1(B) * Imprinting indicates up to 3 significant digits but ordered resistance 0.22.8 50 to <100 0.1(B) value is traceable by date code MQP 0.125 100 to <1k 0.02(Q) 0.05(A) 0.1(B) 0.21.8 0.01(T) 0.02(Q) 0.05(A) CONFIGURATION (DIMENSIONS IN mm) 1k to 40k 0.1(B) POWER DERATING CURVE (%) 200 150 100 50 70 25 50 75 100 125 150 175 (C) Ambient Temperature FREQUENCY CHARACTERISTICS (%) Type MPP MQP 150 MPP L 3.20.2 4.50.2 W 2.50.2 3.20.2 100 H 2.00.2 100 500 L 0.60.2 0.80.2 1 k 1 W 1.40.3 1 50 5 k W 2.30.2 3.00.2 2 30 k 10 k 51050 100 500 1,000 (MHz) H 1.50.3 1 Frequency t 0.150.05 www.alpha-elec.co.jp For any questions, contact Document No.: 67040 6 sales-alpha alpha-elec.co.jp Revision: 01-Jun-2017 R(AC)/R(DC) Rated PowerMPP, MQP Series PERFORMANCE Specification Typical Parameters Test Condition MPP/MQP MP/MQ MPP/MQP Maximum Rated Operating Temperature 125C Working Temperature Range 65C to +175C Maximum Working Voltage MPP = 50V, MQP = 100V Maximum Working Current 350 mA Thermal Shock 65C/30 min.+150C/30 min., 5 cycles 0.05% 0.01% 0.005% Overload Rated Voltage x 2.5, 5 sec. 0.05% 0.01% 0.005% Low Temperature Storage and Life 65C, No Load, 24 hrs.Rated Voltage, 45 min. 0.05% 0.01% 0.005% Outstanding PC Board Bending 3 mm Bend, 60 sec. 0.05% 0.01% 0.005% Dielectric Withstanding Voltage 0.01% 0.01% 0.005% AC 200V, 1 min. Insulation Resistance DC 100V, 1 min. over 10,000 M Resistance to Soldering Heat 260C, 10 sec. 0.05% 0.03% 0.01% Moisture Resistance +65C to 10C, 90% RH to 98% RH, Rated Voltage, 0.05% 0.03% 0.01% 10 cycles (240 hrs.) Shock 100G, 6 ms, Sawtooth Wave, X, Y, Z, each 10 shocks 0.02% 0.02% 0.01% Vibration, High Frequency 20G, 10 Hz to 2,000 Hz to 10 Hz, 20 min., X, Y, Z, each 2.5 hrs. 0.02% 0.02% 0.01% Storage Life 15C to 35C, 15% RH to 75% RH, No Load, 10,000 hrs. 0.005% 0.005% 0.0025% High Temperature Exposure 175C, No Load, 2,000 hrs. 0.05% 0.05% 0.03% 70C, Rated Power, 1.5 hr. on, 0.5 hr. off, 2,000 hrs. 0.01% 0.005% Life 70C, Rated Power 2, 1.5 hr. on, 0.5 hr. off, 2,000 hrs. 0.03% 0.01% TAPE AND REEL PACKAGE (BASED ON EIA-481-1) (DIMENSIONS IN mm) Tape Dimensions Reel Dimensions Type A B C D E F G H J A N B C D W1 W2 r 2.8 3.9 12.0 5.5 1.75 4.0 2.0 4.0 Dia. 1.5 Dia. 178 Dia. 60 Dia. 13 Dia. 21 2 12.4 18.4 1.0 MPP 0.2 0.2 0.3 0.05 0.1 0.1 0.05 0.1 0.1-0 2 min. 0.5 0.8 0.5 +2.0-0 max. 0.5 3.6 5.2 12.0 5.5 1.75 8.0 2.0 4.0 Dia. 1.5 Reel Capacity MQP 0.2 0.2 0.3 0.05 0.1 0.1 0.05 0.1 0.1-0 MPP: 1,200 pieces/reel MQP: 800 pieces/reel PRECAUTION IN USING FACE-BONDED CHIP RESISTORS 1. Storage 3. Cleaning Storage conditions or environment may adversely affect solderability of Use volatile cleaner such as methylalcohol or propyl alcohol. the exterior terminals. Do not store in high temperature and humidity. 4. Circuit Board Design The recommended storage environment is lower than 40C, has less The dimensions of solder land must be determined in conformity with than 70% RH humidity and is free from harmful gases such as sulphur the size of resistors and with the soldering method. They are also and chlorine. subject to the mounting machine and the material of the substrate. See 2. Caution in Soldering example below. Hand SolderingHand soldering is applicable as shown at right. Solder resist Adhesive (in wave soldering) Recommended Temp. of iron tip: 240C to 270C (C) B Power of iron: 20W or less 350 Terminal Diameter of tip: dia. 3 mm max. 310 Resistor Solder Reflow in Furnace Not Applicable 270 Recommended Circuit Board Applicable Peak temperature: 250+0/-5C D 230 Solder land Holding time: 10 sec. max. 10 20 30 40 50 60 (sec.) To cool gradually at room temperature Length of contact Type Dipping in Solder (Wave or Still) A B C D Recommended MPP 1.8 1.6 to 2.0 0.5 to 1.5 2.2 to 2.6 Temp. of solder: 260C max 2.5 MQP Length of dipping: 10 seconds Dimensions in mm To cool gradually at room temperature When parts are mounted on a board in high density, solder can possibly Other attach to the resistors in an excessive amount to affect performance or Corrosion-free flux, such as rosin, is recommended. Do not apply reliability of the resistors. To prevent this effect, the use of solder resist pressure to the molded housing immediately after soldering. is recommended to isolate solder lands. Document No.: 67040 For any questions, contact www.alpha-elec.co.jp Revision: 01-Jun-2017 sales-alpha alpha-elec.co.jp 7 Temp. of Iron A C