MP, MQ Series ( ) Ultra Precision SMT Resistor Molded, J-Lead Terminal TCR, RESISTANCE RANGE, TOLERANCE, RATED POWER Rated TCR (ppm/C) Resistance Resistance Power Type 55C to Range Tolerance (W) +125C () (%)* at 125C 010 30 to 100 0.1 MP 0.1 MQ 05 100 to 30k 0.05 010 30 to 100 0.1 MQ 0.125 05 100 to 60k 0.05 * Please contact us for tighter tolerances. MP POWER DERATING CURVE COMPOSITION OF TYPE NUMBER MQ 10K00 L Resistance value, in ohm, is expressed by a series of five characters, four of which represent significant digits. R or K is a dual-purpose letter that designates both the value range (R for ohmic K for kilo-ohm) and the location of the decimal point. FREQUENCY CHARACTERISTICS CONFIGURATION (DIMENSIONS IN mm) (%) MP 150 50 100 100 500 1 k 50 L 5 k 30 k 10 k 51050 100 500 1,000 (MHz) Frequency t TEMPERATURE OF RESISTOR SURFACE L1 W1 W2 Type MP MQ L 3.20.2 4.50.2 W 2.50.2 3.20.2 H 2.00.2 L 0.60.2 0.80.2 1 W 1.40.3 1 W 2.30.2 3.00.2 2 H 1.50.3 1 t 0.150.05 www.alpha-elec.co.jp For any questions, contact Document No.: 67000 8 sales-alpha alpha-elec.co.jp Revision: 25-Apr-2016 H W H1 R(AC)/R(DC)MP, MQ Series PERFORMANCE ALPHA ALPHA Typical Parameters Test Condition Specification Test Data Maximum Rated Operating Temperature 125C Working Temperature Range -65C to +175C Maximum Working Voltage MP=50V, MQ=100V Maximum Working Current 350 mA Thermal Shock 65C/30 min.+175C/30 min., 5 cycles 0.05% 0.01% Overload Rated Voltage x 2.5, 5 sec. 0.05% 0.01% Low Temperature Storage and Operation 65C, No Load, 24 hrs.Rated Voltage, 45 min. 0.05% 0.01% Substrate Bending Test Substrate Bent 3 mm, 60 sec. 0.05% 0.01% Dielectric Withstanding Voltage Atmospheric: AC 200V, 1 min. 0.01% 0.005% Insulation Resistance DC 100V, 1 min. over 10,000 M over 10,000 M Resistance to Soldering Heat 260C, 10 sec. 0.05% 0.01% Moisture Resistance +65C to 10C, 90% RH to 98% RH, Rated Voltage, 10 cycles (240 hrs.) 0.05% 0.03% Shock 100G, 6 ms, Sawtooth Wave, X, Y, Z, each 10 shocks 0.02% 0.01% Vibration, High Frequency 20G, 10 Hz to 2,000 Hz to 10 Hz, 20 min., X, Y, Z, each 2.5 hrs. 0.02% 0.01% Life 125C, Rated Power, 1.5 hr. ON, 0.5 hr. OFF, 2,000 hrs. 0.05% 0.03% Storage Life 15C to 35C, 15% RH to 75% RH, No Load, 10,000 hrs. 0.005% 0.0025% High Temperature Exposure 175C, No Load, 2,000 hrs. 0.05% 0.03% TAPE AND REEL PACKAGE (BASED ON EIA-481-1) (DIMENSIONS IN mm) Tape Dimensions Reel Dimensions Type A B C D E F G H J A N B C D W1 W2 r 2.8 3.9 12.0 5.5 1.75 4.0 2.0 4.0 Dia. 1.5 Dia. 178 Dia. 60 Dia. 13 Dia. 21 2 12.4 18.4 1.0 MP 0.2 0.2 0.3 0.05 0.1 0.1 0.05 0.1 0.1-0 2 min. 0.5 0.8 0.5 +2.0-0 max. 0.5 3.6 5.2 12.0 5.5 1.75 8.0 2.0 4.0 Dia. 1.5 Reel Capacity MQ 0.2 0.2 0.3 0.05 0.1 0.1 0.05 0.1 0.1-0 MP: 1,200 pieces/reel MQ: 800 pieces/reel PRECAUTION IN USING FACE-BONDED CHIP RESISTORS 1. Storage 3. Cleaning Storage conditions or environment may adversely affect solderability of Use volatile cleaner such as methylalcohol or propyl alcohol. the exterior terminals. Do not store in high temperature and humidity. 4. Circuit Board Design The recommended storage environment is lower than 40C, has less The dimensions of solder land must be determined in conformity with than 70% RH humidity and is free from harmful gases such as sulphur the size of resistors and with the soldering method. They are also and chlorine. subject to the mounting machine and the material of the substrate. See 2. Caution in Soldering example below. Hand Soldering Solder resist Adhesive (in wave soldering) Hand soldering is applicable as shown at right. Recommended (C) B 350 Temp. of iron tip: 240C to 270C Terminal Power of iron: 20W or less Resistor 310 Diameter of tip: dia. 3 mm max. Not Applicable 270 Solder Reflow in Furnace Circuit Board Applicable D 230 Recommended Solder land Peak temperature: 250+0/-5C 10 20 30 40 50 60 (sec.) Length of contact Holding time: 10 sec. max. Type A B C D To cool gradually at room temperature MP 1.8 Dipping in Solder (Wave or Still) 1.6 to 2.0 0.5 to 1.5 2.2 to 2.6 MQ 2.5 Recommended Dimensions in mm Temp. of solder: 260C max Length of dipping: 10 seconds To cool gradually at room temperature When parts are mounted on a board in high density, solder can possibly Other attach to the resistors in an excessive amount to affect performance or Corrosion-free flux, such as rosin, is recommended. Do not apply reliability of the resistors. To prevent this effect, the use of solder resist pressure to the molded housing immediately after soldering. is recommended to isolate solder lands. Document No.: 67000 For any questions, contact www.alpha-elec.co.jp Revision: 25-Apr-2016 sales-alpha alpha-elec.co.jp 9 Temp. of Iron A C