MU Series Ultra Precision SMT Resistor 1-2-3 Network (Molded, J-Lead Terminal) RESISTANCE RANGE, TOLERANCE, RATED POWER Resistance Rated Power/ Resistance Tolerance* Type Range Element Element** Absolute* Matching* (W) at 125C 0.05% (A) 0.1% (B) 10 R <100 0.1% (B) 0.5% (D) MU 0.5% (D) 0.02% (Q) 0.05% (A) 0.05% (A) 100 R <1k 0.1% (B) 0.1% (B) MU 0.5% (D) 0.05 0.5% (D) COMPOSITION OF TYPE NUMBER 0.01% (T) 0.02% (Q) 0.02% (Q) 0.05% (A) 1k R 20k 0.05% (A) MU 1K000/ 10K00 B Q L 0.1% (B) 0.1% (B) 0.5% (D) 0.5% (D) * Symbols in parentheses are for type number composition. ** Please contact us for the availability. ABSOLUTE TCR TCR TRACKING Absolute TCR TCR Track- Resistance (ppm/C) Resistance ing (ppm/C) CONFIGURATION (DIMENSIONS IN mm) Range () 55C to Ratio 55C to +125C +125C L Internal Circuit (Top View) P1 P1 Common PIN 10 R <30 15 Ratio = 1 1 PIN 2 30 R <100 10 1 <Ratio 10 2 R1 R2 100 R 20k 5 10 <Ratio 100 3 100 <Ratio 5 P3 P2 P3 PIN 1 PIN 3 Applicable >50 L1 W1 FREQUENCY CHARACTERISTICS L2 (%) t W3 W3 L3 L3 150 L4 W2 47.5 L W H H H H P P P 1 2 3 1 2 3 100 100 1 k 3.2 2.5 1.5 1.4 1.6 1.1 1.6 1.4 0.9 5 k 0.2 0.2 0.2 0.2 0.2 0.2 0.1 0.1 0.1 50 10 k W W W L L L L t 1 2 3 1 2 3 4 20 k 2.7 2.7 0.8 3.0 0.7 0.8 3.0 0.1 1 10 100 (MHz) 0.2 0.2 0.1 0.2 0.2 0.1 0.2 0.05 Frequency POWER DERATING CURVE EXAMPLE OF APPLICATIONS (%) An Application of Type MU (input/feedback resistors for amplifiers) 100 Because the input and the feedback resistors are incorporated into one single element, amplification is not affected by temperature change. 80 60 40 20 125 150 20 40 60 80 100 120 140 160 C Ambient Temperature www.alpha-elec.co.jp For any questions, contact Document No.: 67005 10 sales-alpha alpha-elec.co.jp Revision: 01-Jun-2017 H1 Rated Power Percentage H W H3 H2 R(AC)/R(DC)MU Series PERFORMANCE ALPHA ALPHA Typical Specification Test Data Parameters Test Condition R Ratio R Ratio Maximum Rated Operating Temperature 125C Working Temperature Range 65C to +150C Thermal Shock 65C/30 min. +150C/30 min., 5 cycles 0.05% 0.02% 0.01% 0.005% Overload Rated Voltage x 2.5, 5 sec. 0.05% 0.02% 0.01% 0.005% Low Temperature Storage and Operation 65C, No Load, 24 hrs. Rated Voltage, 45 min. 0.05% 0.02% 0.01% 0.005% Substrate Bending Test 3 mm Bend 60 sec. 0.05% 0.02% 0.01% 0.005% Dielectric Withstanding Voltage Atom. Pres.: AC 200V, 1 min. 0.01% 0.01% 0.005% 0.0025% Insulation Resistance DC 100V, 1 min. over 10,000 M over 10,000 M Resistance to Soldering Heat 260C, 10 sec. 0.05% 0.02% 0.01% 0.005% Moisture Resistance +65C to 10C, 90% to 98% RH, Rated Power, 10 cycles 0.05% 0.02% 0.03% 0.01% (240 hrs.) Shock 100G, 6 ms, Sawtooth Wave, X, Y, Z, each 10 shocks 0.02% 0.01% 0.01% 0.005% Vibration, High Frequency 20G, 10 Hz to 2,000 Hz to 10 Hz, 20 min., X, Y, Z, each 2.5 hrs. 0.02% 0.01% 0.01% 0.005% Life 125C, Rated Power, 1.5 hrs. ON, 0.5 hrs. OFF, 2,000 hrs. 0.05% 0.02% 0.03% 0.015% Storage Life 15C to 35C, 15% RH to 75% RH, No Load, 10,000 hrs. 0.005% 0.0025% 0.0025% 0.0015% High Temperature Exposure 150C, No Load, 2,000 hrs. 0.05% 0.02% 0.02% 0.01% TAPE AND REEL PACKAGE (BASED ON EIA-481-1) (DIMENSIONS IN mm) Tape Dimensions Reel Dimensions (Reel capacity: 800 pieces/reel) Type A B C D E F G H J A N B C D W W r 1 2 3.6 3.1 12.0 5.5 1.75 8.0 2.0 4.0 Dia. 1.5 Dia. 178 Dia. 60 Dia. 13 Dia. 21 2 12.4 18.4 1.0 MU 0.2 0.2 0.3 0.05 0.1 0.1 0.05 0.1 +0.1-0 2 min. 0.5 0.8 0.5 +2.0-0 max. 0.5 PRECAUTION IN USING FACE-BONDED CHIP RESISTOR (DIMENSIONS IN mm) 1. Storage Other Storage condition or environment may adversely affect solderability of Corrosion-free flux, such as rosin, is recommended. Do not apply the exterior terminals. Do not store in high temperature and humidity. pressure to the molded housing immediately after soldering. The recommended storage environment is lower than 40C, has less 3. Cleaning than 70% RH humidity and is free from harmful gases such as sulphur Use volatile cleaner such as methylalcohol or propylalcohol. and chlorine. 4. Circuit Board Design 2. Caution in Soldering The dimensions of solder land must be determined in conformity Hand Soldering with the size of resistors and with the soldering method. They are also Hand soldering is applicable subject to the mounting machine and the material of the substrate. as shown at right. See example below. Terminal Recommended Temp. of lron Tip: 240C to 270C 1.60.1 Power of lron: 20W or less Terminal Diameter of Tip: Dia. 3 mm max. Solder Reflow in Furnace MU Recommended Peak Temperature: 250C +0C/-5C Solder Land Holding time: 10 sec. max. 0.90.1 Circuit Board To cool gradually at room temperature 2.50.1 Dipping in Solder (Wave or Still) Recommended When parts are mounted on a board in high density, solder can possibly Dimensions in mm Temp. of Solder: 240C to 250C attach to the resistors in an excessive amount to affect performance or Length of Dipping: 3 to 4 seconds reliability of the resistors. To prevent this effect, the use of solder resist is To cool gradually at room temperature recommended to isolate solder lands. Document No.: 67005 For any questions, contact www.alpha-elec.co.jp Revision: 01-Jun-2017 sales-alpha alpha-elec.co.jp 11 0.70.1 0.70.1 1.40.1