RBD, RBF, RBH Series Ultra Precision SMT Current Sense Resistor (Flip-Chip) TCR, RESISTANCE RANGE, TOLERANCE, RATED POWER Rated Resistance Resistance TCR (ppm/C) Power Type Range Tolerance 25C to 125C* (W) () (%)* at 70C 1 (F) 2 (G) RBH 025 (J) 0.01 to 0.1 5 (J) RBD 0.5 010 (C) 0.5 (D) 1 (F) 0.1 to 1 025 (J) 2 (G) 5 (J) RBF 1 (F) 2 (G) 025 (J) 0.01 to 0.1 5 (J) RBF 1 RBD 010 (C) 0.5 (D) 1 (F) 0.1 to 1 025 (J) 2 (G) 5 (J) 010 (C) 0.5 (D) 1 (F) RBH 0.01 to 0.1 1.5 025 (J) 2 (G) 5 (J) COMPOSITION OF TYPE NUMBER *Symbols parenthesized are for type number composition. RBF J R1000 F L POWER DERATING CURVE Resistance value in ohm is expressed by a series of four significant digits and an R designates the decimal point. CONFIGURATION (DIMENSIONS IN mm) Type RBD RBF T L 3.20.1 6.30.1 L 2.50.1 3.20.1 W 0.70.2 L1 0.50.2 4.70.2 L2 2.10.2 W1 2.40.2 3.00.2 L2 L1 TEMPERATURE OF RESISTOR SURFACE T 1.05 max. Dimensions in mm Temperature Measurement (Glazed Epoxy Board) (in still air) RBD R = 42.8C/W Type RBH Mounting T RBF R = 38.0C/W L L Board 7.50.1 RBH R = 46.2C/W T (C) W Center of 6.00.1 V V 80 Element Surface L1 1.40.2 70 I I L2 4.40.2 Mounted on Glazed Epoxy Board W1 1.40.2 60 (100 mm x 40 mm x 1.6 mmt) W2 0.70.2 50 W3 3.60.2 L1 L2 T 1.5 max. 40 I: Current Sensing Terminal RBH Dimensions in mm V: VoltageTerminal 30 Mounted on Aluminum Board RBF (100 mm x 40 mm x 2.0 mmt) 20 RBD 10 CONSTRUCTION 0.5 1.0 1.5 (W) 6 1 Ceramic Substrate (High-Purity Alumina) 3 5 Applied Power Heat-Resistant Bonding Layer 2 3 Bulk Metal Foil 4 Please use board made of metal for continuous use with 2W at 70C. 4 Metal Plating 2 Please keep the temperature of board less than 90C when using the Solder 5 glazed epoxy board. 6 Solder-Resist 1 www.alpha-elec.co.jp For any questions, contact Document No: 67011 12 sales-alpha alpha-elec.co.jp Revision: 25-Apr-2016 W2 W3 W1 W1 W W Temperature RiseRBD, RBF, RBH Series PERFORMANCE ALPHA ALPHA Typical Parameters Test Condition Specification Test Data Maximum Rated Operating Temperature 70C Working Temperature Range 65C to +155C Thermal Shock 65C/30 min. +155C/30 min., 5 cycles 0.1% 0.03% Overload Rated Voltage x 2.5, 5 sec. 0.1% 0.03% Low Temperature Storage and Operation 65C, No Load, 24 hrs. Rated Voltage, 45 min. 0.1% 0.05% Substrate Bending Test Substrate Bent 3 mm, 60 sec. 0.1% 0.05% Dielectric Withstanding Voltage Atmo. Pres.: AC 200V, 1 min. 0.05% 0.01% Insulation Resistance DC 100V, 1 min. over 10,000 M over 10,000 M Resistance to Soldering Heat 260C, 10 sec. 0.1% 0.03% Moisture Resistance +65C to 10C, 90% RH to 98% RH, Rated Voltage, 10 cycles (240 hrs.) 0.1% 0.03% Shock 100G, 6 ms, Sawtooth Wave, X, Y, Z, each 10 shocks 0.05% 0.01% Vibration, High Frequency 20G, 10 Hz to 2,000 Hz to 10 Hz, 20 min., X, Y, Z, each 2.5 hrs. 0.05% 0.01% Life 70C, Rated Power, 1.5 hr. ON, 0.5 hr. OFF, 2,000 hrs 0.1% 0.05% Storage Life 15C to 35C, 15% RH to 75% RH, No Load, 10,000 hrs. 0.05% 0.01% High Temperature Exposure 155C, No Load, 2,000 hrs. 0.1% 0.05% TAPE AND REEL PACKAGE (BASED ON EIA-481-1) (DIMENSIONS IN mm) Tape Dimensions Reel Dimensions Reel Capacity RBH: 1,000 pieces/reel RBD, RBF: 4,000 pieces/reel Type A B W F E P P P D Type A N B C D W W r 0 0 1 2 0 0 1 2 2.85 3.7 8.0 3.5 1.75 4.0 2.0 4.0 Dia.1.5 Dia.178 Dia.60 Dia.13 Dia.21 2.0 8.4 14.4 1.0 RBD RBD 0.1 0.1 0.2 0.05 0.1 0.1 0.05 0.1 +0.1-0 2 min. 0.5 0.8 0.5 +2.0-0 max. 0.5 3.4 6.7 12.0 5.5 1.75 4.0 2.0 4.0 Dia.1.5 Dia.178 Dia.60 Dia.13 Dia.21 2.0 12.4 18.4 1.0 RBF RBF 0.1 0.1 0.2 0.05 0.1 0.1 0.05 0.1 +0.1-0 2 min. 0.5 0.8 0.5 +2.0-0 max. 0.5 6.3 7.8 16.0 7.5 1.75 8.0 2.0 4.0 Dia.1.5 Dia.178 Dia.60 Dia.13 Dia.21 2.0 17.0 19.4 1.0 RBH RBH 0.1 0.1 0.2 0.1 0.1 0.1 0.1 0.1 +0.1-0 2 min. 0.5 0.8 0.5 0.3 0.1 0.5 PRECAUTION IN USING SMD CURRENT SENSE RESISTORS 1. Storage RBD, RBF RBH Storage condition or environment may adversely affect solderability of the exterior terminals. Do not store in high temperature and humidity. The recommended storage environment is lower than 40C, has less than 70% RH humidity and is free from harmful gases such as sulphur and chlorine. 2. Caution in Soldering C B Solder Reflow in Furnace C B Recommended Peak Temperature: 250+0/-5C Dimensions in mm Type Holding time: 10 sec. max. A B C D E To cool gradually at room temperature. RBD 2.6 to 2.8 0.8 2.0 Dipping in Solder (Wave or Still) RBF 3.4 to 3.6 1.2 4.5 Recommended RBH 3.8 to 4.0 2.0 4.0 0.5 1.7 Temp. of Solder: 260C max. Length of Dipping: 10 sec. Circuit Design Other It is recommended that the circuit be drawn so that current may Soldering iron is never recommended. Corrosion-free flux such approach, cross and go away from the mounted resistor in one as rosin is recommended. direction as illustrated below. Thicker copper foil should be used 3. Cleaning if possible. Use volatile cleaner such as methylalcohol or propylalcohol. 4. Circuit Board Design Solder Land Dimensions The dimensions of solder land must be determined in conformity with the size of resistors and with the soldering method. They are also subject to the mounting machine and the material of the substrate. See example at right. Document No: 67011 For any questions, contact www.alpha-elec.co.jp Revision: 25-Apr-2016 sales-alpha alpha-elec.co.jp 13 A D A E