X-On Electronics has gained recognition as a prominent supplier of RE272FDEC23HJE CPU - Central Processing Units across the USA, India, Europe, Australia, and various other global locations. RE272FDEC23HJE CPU - Central Processing Units are a product manufactured by AMD. We provide cost-effective solutions for CPU - Central Processing Units, ensuring timely deliveries around the world.

RE272FDEC23HJE AMD

RE272FDEC23HJE electronic component of AMD
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Part No.RE272FDEC23HJE
Manufacturer: AMD
Category: CPU - Central Processing Units
Description: MPU Embedded R RISC 64bit 3.2GHz 722-Pin uPGA
Datasheet: RE272FDEC23HJE Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 130.296 ea
Line Total: USD 130.3 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Wed. 25 Dec to Tue. 31 Dec
MOQ : 1
Multiples : 1
1 : USD 130.296

0
Ship by Wed. 25 Dec to Tue. 31 Dec
MOQ : 5
Multiples : 5
5 : USD 135.3512

   
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We are delighted to provide the RE272FDEC23HJE from our CPU - Central Processing Units category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the RE272FDEC23HJE and other electronic components in the CPU - Central Processing Units category and beyond.

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Product Brief AMD Embedded R-Series Platform Delivering exceptional performance in a power-efficient platform AMD Embedded R-Series CPUs are designed for applications Product Overview that require high performance x86 compute such as network The AMD Embedded R-Series Processor platform delivers attached storage (NAS). These options include quad-core and high-performance processing coupled with a premium high- dual-core CPUs scaling from 2.2 GHz to 3.2 GHz at 17 watts to definition visual experience in a solution that is power efficient. 35 watts thermal design power (TDP). The AMD R-Series CPUs It enables unprecedented integrated graphics and multi-display can be combined with discrete AMD Embedded 6460 or 6760 capabilities in compact, low power embedded applications. Radeon graphics for driving up to 10 independent displays. These options provide cost-effective solutions for maximum The AMD R-Series APU (Accelerated Processing Unit) is compute and graphics capabilities. designed to efficiently handle advanced multimedia and 1 computational workloads. With average power below 13 Watts Additional Features and Benefits and discrete-class AMD Radeon HD 7000G Series graphics integrated into the AMD R-Series APU, applications that Har dware Video Compression Engine enables efficient previously required a discrete graphics card can be developed encoding and fast video conversion. with a single-chip solution in smaller form factors with lower S ecure Asset Management Unit lowers power/CPU power and cost. The third generation Unified Video Decoder overhead when dealing with protected content. in the AMD R-Series APU enables the delivery of crisp and clear video for ad content, instructional materials, or live A wide r ange of parallel compute capabilities offered to suit teleconferencing. For more demanding graphics applications, the requirements of many embedded applications. 2 AMD Radeon Dual Graphics technology combines the processing power of AMD R-Series APUs and discrete AMD Enabling Innovative Multi-display Designs Radeon Embedded 6000 Series GPUs to more than double 5 3 Drive up t o 4 displays from a single highly integrated graphics performance compared to using discrete graphics alone. processor. Drive multiple displays simultaneously as independent The innovative CPU architecture integrates dedicated resources displays, or as a single large surface with AMD Eyefinity that deliver exceptional performance, with shared resources 6 technology. that reduce power consumption and die space. And through AMD Turbo CORE 3 technology the power being consumed by Display resolutions of up to 4k x 2k 30 Hz utilizing a the APU is allocated to accomplish the work at hand, helping to single display output. minimize unnecessary system optimization by automatically Drive up to 10 independent displays by pairing an AMD delivering an optimized balance between performance and R-Series power consumption. APU with an AMD Radeon Embedded 6000 Series discrete With between 128 and 384 compute units delivering a calculated 5,6 graphics processor or card. 4 172 to 563 SP GFLOPs of performance, AMD R-Series APUs help enable a wide range of compute intensive applications that are low power and fit into small form factors. Support for Open-CL helps make it easier to take advantage of a substantial increase in performance, for applications that can leverage parallel processing.Memory Controller VCE SAMU 2 Product Brief: AMD Embedded R-Series Platform Key Architecture Benefits Display Interfaces Processor Features Multiple DisplayPort 1.2, DVI and HDMI 8 High performance integrated x86 cores Up to 4 independent displays AMD R adeon HD 7000G Series graphics integrated into the AMD R-Series APUs AMD Virtualization Technology (AMD-V) Unified North Bridge SVM pause count capability High-bandwidth, low-latency integrated SVM disable and lock memory controller Rapid virtualization indexing (nested paging) Low-latency platform interface Improved world-switch speed x86 Core Architecture I/O Dual or quad-core x86 processor Gen2 PCI Express x16 Interface (x8 on FP2 packaged 2nd Generation Bulldozer core architecture APUs) - Combination of dedicated and shared resources Additional 4x1 or 1x4 Gen2 PCI Express interface on APU 256-bit shared or two dedicated 128-bit floating-point See controller hub table for detailed I/O features of A70M units (FPU) and A75 - Shared between two cores AMD64 64-bit ISA Package SSE, SSE2, SSE3, SSE4a, SSE4.1, SSE4.2, SSSE3, ABM, APU/CPU FS1r2 AVX, AVX1.1, AES, BMI, XSAVE/XRSTOR, XGETBV/ - 722-pin lidless PGA XSETBV, PCLMULQDQ, FMA, FMA4, TBM, XOP, MMX, - 35mm x 35mm and legacy x86 instructions - 1.2192-mm pin pitch APU/CPU FP2 Integrated DDR3 Memory Controller - 827-ball lidless BGA Two 64-bit DDR3 SDRAM controllers operating at - 27mm x 31mm frequencies up to 1600 MT/s (800 MHz) - .8mm to 1.2-mm ball pitch Two single-rank SO-DIMMs or unbuffered DIMMs C ontroller Hub Support for 1.5V/1.35V/1.25V DDR3 - 656-ball lidless BGA - 24.5mm x 24.5mm APU Integrated Graphics Core Architecture - 8mm ball pitch Dedicated graphics memory controller - High efficiency ring bus memory controller 2 DDR3 SO-DIMMS - Direct connection to memory 2D Acceleration - Highly-optimized 128-bit engine, capable of processing multiple pixels per clock 3D Acceleration - Full DirectX 11 support, including full speed 32-bit SIMD Engine Array floating point per component operations x86 Cores - Shader Model 5 - OpenCL 1.1 support Unified Video - OpenGL 4.2 support Decoder UVD 3.2 dedicated hardware video decoder 7 - H.264, MPEG4 Part 2, VC-1 and MPEG2 decode - Simultaneous dual HD source decode Platform Interfaces VCE (Video Compression Engine) 1.0 - Hardware assisted encoding of HD video streams - H.264 (baseline + CABAC) 1080p at 60 fps Unified - Real time transcoding Media Interface PCI Express HDMI DVI x16 PCIe Controller Hub USB 2 SATA VGA PCIe 4x1 LPC HD Audio USB 3.0 SPI CIR Optional

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
AMD (Advanced Micro Devices)
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