10018783-10212TLF Amphenol

PCI Express Gen 3 Card Edge Connectors SPECIALLY DESIGNED 8Gb/s SOCKETS FOR LOW PROFILE SYSTEMS Amphenol ICCs 1.00mm pitch, vertical card edge connectors enable PCI Express (PCIe ) signalling from 2.5Gb/s (Gen 1) and 5Gb/s (Gen 2) up to 8Gb/s (Gen 3) per differential signal pair. A modular design of these connectors allow standard pin counts like 36, 64, 98, 164 and 280. The basic bandwidth (x1) version supports a single PCI Express lane and is typically used for I/O cards in desktop PCs. The x4 and x8 connectors provide 64 and 98 contacts respectively for server I/O. The high bandwidth versions (x16 lanes and higher) are used for higher TARGET MARKETS bandwidth applications like graphics cards in PCs or riser cards in servers. Available in through-hole, press-fit and surface-mount terminations Available in straddle-mount orientation Supports a wide range of bandwidth and performance requirements FEATURES BENEFITS Connector range offers x1, x4, x8, or x16 serial PCIe links Supports different bandwidth requirements 200, 230 (x24), and 280 position vertical connectors Supports PC and server riser cards available ExpressModule versions provide an expanded lead-in Supports blind mate server applications window Straddle mount connectors featuring mounting ears Assures proper alignment to the host PCB Integrate rugged stand-alone retention mechanism Secures graphics cards during shipping and handling Amphenol Information Communications and Commercial Products www.amphenol-icc.com PCI Express Gen 3 Card Edge Connectors TECHNICAL INFORMATION MATERIAL SPECIFICATIONS Contact Base Metal: Copper alloy Amphenol Product Specification: GS-12-1193 PCI Express 3.0 Straddle Mount Contact Area Finish: Gold over nickel Connectors Product Specification Solder Area Finish: Tin over nickel or tin-lead over Nickel GS-12-233 PCI Express Connector Product Metal Board Locks: Copper alloy Specification Board Locks Finish: Tin over nickel or tin-lead over nickel GS-12-319 PCI Express Press-Fit Connector Product Specification Housing: High-temperature thermoplastic CS-12-288 PCI Express Rentention ELECTRICAL PERFORMANCE Mechanism Product Specification GS-12-390 PCI Express Surface-Mount Contact Resistance: Connector Product Specification Initial: 30m max. Industry Specification: Finish: Delta 20m max. PCI Express Card Electromechanical Current Rating: 1.1A for 8 specified power contacts and 8 Specification nearest ground contacts PCI Express Module Electromechanical Voltage Rating: 50V AC (rms) Specification For more information on the applicable PCI- MECHANICAL PERFORMANCE SIG specification, visit www.pcisig.com Durability: 50 mating cycles PACKAGING Insertion Force: 1.15N (0.117Kgf) max. per contact pair Tray Withdrawal Force: 0.15N (0.015Kgf) min. per contact pair TOOLING INFORMATION Contact Retention Force: 0.5Kgf min. per pin Tooled Up ENVIRONMENTAL TARGET MARKETS/APPLICATIONS Salt Spray: Contact Resistance 20 max. final) Desktop PC Thermal Shock: Contact Resistance (20 max. final) Server Solderability: 90% of immersed area must show no voids and Workstation pin holes APPROVALS AND CERTIFICATIONS UL CSA Disclaimer www.amphenol-icc.com Please note that the above information is subject to change without notice.