Type NUMBER PRODUCT SPECIFICATION GS-12-390 TITLE PAGE REV. TM A PCI EXPRESS SMT TYPE CONNECTOR 1 of 10 AUTHORIZED BY DATE Richard Chiu 01/24/07 TABLE OF CONTENTS SECTION 1 INTRODUCTION SECTION 2 GENERAL REQUIREMENTS SECTION 3 MECHANICAL 3.1 EXAMINATION OF PRODUCT 3.2 INSERTION/WITHDRAWAL FORCES ADD IN CARD 3.3 CONTACT RETENTION 3.4 SOLDERABILITY SECTION 4 ELECTRICAL 4.1 LOW LEVEL CONTACT RESISTANCE 4.2 INSULATION RESISTANCE 4.3 DIELECTRIC WITHSTANDING 4.4 CONTACT CURRENT RATING 4.5 INSERTION LOSS 4.6 RETURN LOSS 4.7 CROSSTALK SECTION 5 ENVIRONMENTAL 5.1 THERMAL SHOCK 5.2 CYCLIC TEMPERATURE AND HUMIDITY 5.3 TEMPERATURE LIFE (PRE-CONDITIONING) 5.4 TEMPERATURE LIFE 5.5 VIBRATION 5.6 DURABILITY (PRE-CONDITIONING) 5.7 DURABILITY 5.8 MIXED FLOWING GAS 5.9 RESEATING 5.10 RESISTANCE TO SOLDER HEAT SECTION 6 TEST MATRIX PDS: Rev :A STATUS:Released Printed: Jan 28, 2011 This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI. Form E-3005 GS-01-001 Rev E Type NUMBER PRODUCT SPECIFICATION GS-12-390 TITLE PAGE REV. TM A PCI EXPRESS SMT TYPE CONNECTOR 2 of 10 AUTHORIZED BY DATE Richard Chiu 01/24/07 1.0 INTRODUCTION 1.1 SCOPE This document describes the functional and test requirements TM for the PCI Express card-edge connector. The connector is designed to meet the requirements of the PCI Express Card Electromechanical Specification and certain customer specifications not covered by the PCI-SIG document. 1.2 APPLICABLE DOCUMENTS 1.2.1 Solderability : BUS-19-002/A 1.2.2 PCI Express Card Electromechanical Specification 1.2.3 EIA-364-09,17,20,21,28,31,32,65,70,90,101,108,638. EIA-364-1000.01 test groups 1,2,3 and 4. 1.2.4 PCI Express Connector High Speed Electrical Test Procedure. 1.2.5 FCI drawing, PCI Express connector, inspection & customer copy. 1.3 DRAWING PRECEDENCE In the event of conflict between this document and product prints, the product prints shall take precedence. 2.0 GENERAL REQUIREMENTS 2.1 The connector has the following characteristics: 1.00m(0.040) pitch, X1, X4, X8 sizes, surface mount configuration, rectangular outline, plastic peg or two holdowns requiring solder pad on PCB. 2.2 Visual examination, unless otherwise specified, shall be made at 7X. 2.3 Silicone compounds (mold releases, lubricants, etc.) May not be used in the manufacturing processes. 2.4 Flammability to be rated UL 94V-0. 2.5 Unless otherwise specified, tests that require the use of a pc edge card shall use the following 2.5.1 Card material: FR-4 glass epoxy. 2.5.2 Thickness: 1.57 +/- 0.13 (0.062 +/- 0.005 inch) 2.5.3 Trace material: 0.035 (0.0014 inches), copper. 2.5.4 Trace plating: 0.76 micrometers (30 microinches) minimum gold over 1.27 micrometers (50 microinches) minimum unbrushed nickel 2.5.5 Pad and trace design: pad and trace design shall follow PCI Express standard as depicted in customer drawing. PDS: Rev :A STATUS:Released Printed: Jan 28, 2011 This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI. Form E-3005 GS-01-001 Rev E