Storage & Server IO PCI Express Gen 4 and Gen 5 Card Edge Connectors EXTEND DIFFERENTIAL SIGNALING TO 16GT/s AND 32GT/s FOR NEXT-GENERATION SYSTEMS PCIe Gen 4 and Gen 5 connectors outperform industry standards PCIe 4.0 and 5.0 (proposed) that require higher speed performance. The optimized series supports backwards mating and is footprint compatible with PCIe 3/2/1. These 1.00mm pitch, vertical and right angle card edge connectors enable all generations of PCI Express signaling in desktop PCs, workstations, and servers. The TARGET MARKETS connector designs support 2.5GT/s (Gen 1), 5.0GT/s (Gen 2), 8.0GT/s (Gen 3) and the recent upgrade to 16GT/s (Gen 4), even further to 32GT/s (Gen 5) per differential signal pair. Amphenol ICCs expansive range of vertical PCIe Gen 4 and Gen 5 connectors will include options for surface mount (SMT), through hole solder, press-fit (PF) and straddle mount terminations. Backward mating and footprint compatible Higher speed performance without altering footprint Wide range of positions available Optional ridge feature according to customer preference FEATURES BENEFITS A variety of termination types are available Able to meet different customer soldering requirements Aside from X1, X4, X8, X16 standard links as per PCI-SIG Provides excellent performance and additional options for CEM specification, X24, X32 are also available extreme bandwidth application Backward mating and footprint compatible Outperform Gen 4/5 specification, but also backward compatible to Gen 1/2/3 specification, with the exception of Gen 5 straddle mount Capable to support up to 32GT/s without altering design Customers can upgrade directly to next-generation systems without additional cost in system redesign RoHS compliant Meets environmental, health and safety requirements Low-halogen material Meets next-generation requirements Amphenol Information Communications and Commercial Products www.amphenol-icc.com PCI Express Gen 4 and Gen 5 Card Edge Connectors TECHNICAL INFORMATION MATERIAL ENVIRONMENTAL Contact Base Metal: Copper alloy EIA-364-1000.01. The test groups/sequences and durations are derived from the following requirements: Contact Area Finish: Gold over nickel Durability (mating/unmating) rating of 50 cycles Solder Area Finish: Tin over nickel Field Temperature: 65C Housing Material: High-temperature thermoplastic (UL94V-0) for reflow soldering or thermoplastic (UL94V-0) for wave soldering. Field Life: Seven years Color: Black or off-white Temperature Life (preconditioning): 92 hours at 105C Metal Board Locks: Copper alloy Temperature Life: 168 hours at 105C Board Locks Finish: Tin over nickel Mixed Flowing Gas: 10 days ELECTRICAL PERFORMANCE APPROVALS & CERTIFICATION Contact Resistance: 30m max. initially with 10m max. change CSA after environmental exposures SPECIFICATIONS Current Rating: 1.1A min. per pin for the 8 power pins and 8 nearest ground pins Industry Signal Integrity Summary PCI Express Card Electromechanical Specification The part series shown on this datasheet support PCI Express high PCI Express Module Electromechanical Specification speed electrical requirements for 2.5Gb/s (PCIe Gen 1), 5.0Gb/s For more information on the applicable PCI-SIG (PCIe Gen 2) , 8.0Gb/s (PCIe Gen 3), 16.0Gb/s (PCIe Gen 4) and specifications, visit www.pcisig.com. 32.0Gb/s (PCIe Gen 5) with the exception of those part series specifically noted as PCIe Gen 1 in in the part number tables. AFCI GS-12-1406 PCI Express group of connectors MECHANICAL PERFORMANCE Durability Rating: 50 cycles min. TARGET MARKETS/APPLICATIONS PCB Insertion Force: 1.15 N max. per contact pair Desktop PCs Servers PCB Removal Force: 0.15 N min. per contact pair Workstations PACKAGING Desktop PCs Hard or Soft Tray Notebook PCs Disclaimer www.amphenol-icc.com Please note that the above information is subject to change without notice.