470-2075-600 Amphenol

NeXLev THE MARKET-PROVEN SOLUTION FOR MEZZANINE APPLICATIONS Amphenols NeXLev is an established and proven high- density parallel board connector solution to meet current bandwidth demands in many mezzanine applications in a small footprint. The connectors contain 10, 20 or 30 wafers, with each wafer containing 10 real signal contacts. This yields a usable density of 100, 200 or 300 contacts per connector with up to 145 signals per linear inch (57 signals per linear cm) for single ended configurations. Differential configurations provide up to 73 pairs per linear inch (29 signals per linear cm). The connector also features data rates up to 12.5 Gb/s. Performance can be optimized with additional grounding pins. TARGET MARKETS NeXLev not only improves the design of new systems, it can also be used to upgrade existing designs. Use it to plug in new feature-rich mezzanine cards to an existing system or add more processors or memory in the form of module cards. Delivers high speed and density Up to 12.5 Gb/s performance Stack heights from 10-33mm Low mating force/large mating window Precise alignment features using self-centering BGA interface FEATURES BENEFITS Supports Performance up 12.5 Gb/s Meets the requirements of existing solutions and allows migration for new applications Provides fast time-to-market configurations Market-tested 10, 20 and 30 wafer solutions - Proven solutions installed worldwide Delivers flexibility and density for many applications Offers single ended and differential configuration options to match your design/system requirements - Single Ended Up to 145 signals/linear inch (57 signals/linear cm) - Increase performance with custom grounding patterns - Differential - Up to 73 pairs/linear inch - Designed for multiple connector applications (29 signals/linear cm) Robust, market-proven lead design and BGA attachment Rugged wafer construction provides highly reliable SMT and technology high process yield Open pin field/100 impedance Contact to SMT pad resistance: 1 m maximum Amphenol Information Communications and Commercial Products www.amphenol-icc.com NeXLev TECHNICAL INFORMATION MATERIAL PACKAGING Contact Base Metal: Copper Alloy Hard Tray Contact Area Finish: Gold over Nickel SIGNAL INTEGRITY PERFORMANCE Housing: Liquid Crystal Polymer Impedance: Open Pin Field/100 ELECTRICAL PERFORMANCE Insertion loss: > -0.5 dB 4GHz Current Rating: 1.0 Amp continuous duty Performance: 12.5GHz de-rated TARGET MARKETS/APPLICATIONS Contact Resistance: 10, 11, 12, 13, 15, 18, 20m depending on stack height Communications Dielectric withstanding voltage: 600V RMS Switches/Routers Access Insulation Resistance: 600M Telecom/Datacom MECHANICAL PERFORMANCE Data Router and Server Durability: 100 cycles Low data rate Networking Equipment Storage Servers Mating Force: 0.45 N max per signal contact Actuators Unmating Force: 0.15 N min per signal contact Control Boards Contact Wipe: 1.1mm nominal Industrial & Instrumentation Test Equipment ENVIRONMENTAL Industrial Controls & Instruments Emulation Equipment In accordance with Telcordia GR-1217-CORE and EIA-364-B standards Medical Diagnostic Electronics APPROVALS AND CERTIFICATIONS Monitoring Analyzers UL and CSA Approved Military SPECIFICATION Military Equipment Chemical Detection Systems Product Specification: TB-2144 Application Specification: TB-2082 PRODUCT STACK HEIGHT SELECTOR Plug Heights (mm) 2.5 4.5 6.5 9.5 7.5 10 12 14 17 10.5 13 15 17 20 15.5 18 20 22 25 20.5 23 25 27 30 23.5 26 28 30 33 Standard Sizes: 100, 200, 300 positions Disclaimer www.amphenol-icc.com Please note that the above information is subject to change without notice. Receptacle Heights (mm) MEZZNEXLEV062320LTR